Engineering topics

Rolin, T. D.

Publications and source records attributed to Rolin, T. D..

12 records

NASA NTRS2019

Development of an Additively Manufactured Capacitive Humidity Sensor for the International Space Station

The ability to measure humidity on the International Space Station and other long-duration spaceflight missions is a crucial part of the onboard systems. For example, the Environmental Control and Life Support System (ECLSS) needs to know the amount of humidity in the air to make decisions about whether it should spend power to run the dehumidifier systems to attempt to reclaim that water. Other issues can arise if the humidity reaches too high of levels and condensation builds up on electrical components. With that in mind, it is vital that the spacecraft keeps spare sensors on board or has the ability to manufacture new sensors on demand. An additively manufactured sensor would be additionally beneficial because it would save space onboard that would normally be taken up by spares, save money from costly resupply missions, and allow the sensor to be constantly updated with the most effective design. This Technical Memorandum outlines a development process carried out to design, manufacture, and test an additively manufactured humidity sensor.

Chang, K. T.↗

NASA NTRS2017

Transparent Conductive Ink for Additive Manufacturing

NASA analyzes, tests, packages, and fabricates electrical, electronic, and electromechanical (EEE) parts. Nanotechnology is listed in NASA's Technology Roadmap as a key area to invest for further development.1 This research project focused on using nanotechnology to improve electroluminescent lighting in terms of additive manufacturing and to increase energy efficiency. Specifically, this project's goal was to produce a conductive but transparent printable ink that can be sprayed on any surface for use as one of the electrodes in electroluminescent device design. This innovative work is known as thick film dielectric electroluminescent (TDEL) technology. TDEL devices are used for "backlighting, illumination, and identification due to their tunable color output, scalability, and efficiency" (I.K. Small, T.D. Rolin, and A.D. Shields, "3D Printed Electroluminescent Light Panels," NASA Fiscal Year 2017 Center Innovation Fund Proposal, unpublished data, 2017). These devices use a 'front-to-back' printing method, where the substrate is the transparent layer, and the dielectric and phosphor are layered on top. This project is a first step in the process of creating a 3D printable 'back-to-front' electroluminescent device. Back-to-front 3D-printed devices are beneficial because they can be printed onto different substrates and embedded in different surfaces, and the substrate is not required to be transparent, all because the light is emitted from the top surface through the transparent conductor. Advances in this area will help further development of printing TDEL devices on an array of different surfaces. Figure 1 demonstrates the layering of the two electrodes that are aligned in a parallel plate capacitor structure (I.K. Small, T.D. Rolin, and A.D. Shields, "3D Printed Electroluminescent Light Panels," NASA Fiscal Year 2017 Center Innovation Fund Proposal, unpublished data, 2017). Voltage is applied across the device, and the subsequent electron excitation results in light emission at the top layer.

Patlan, X. J.↗

NASA NTRS2017

A Novel Solid State Ultracapacitor

Novel dielectric materials were researched to develop an internal barrier layer capacitor that is fully solid state. These materials included reduced nanoparticles of barium titanate that were coated with various atomic layer deposited oxides. The nanoparticle powders were then densified into pellets and characterized using a dielectric test fixture over a frequency range of 20 Hz to 2 MHz. Densification and sintering were evaluated using scanning electron microscopic techniques. Ultimately, the samples showing the most promising electrical characteristics of permittivity, dissipation factor and equivalent series resistance were chosen to manufacture devices for subsequent testing.

Cortes-Pena, A. Y.↗

NASA NTRS2017

A Ground-Based Study on Extruder Standoff Distance for the 3D Printing in Zero Gravity Technology Demonstration Mission

Analysis of phase I specimens produced as part of the 3D printing in zero G technology demonstration mission exhibited some differences in structure and performance for specimens printed onboard the International Space Station (ISS) and specimens produced on the ground with the same printer prior to its launch. This study uses the engineering test unit for the printer, identical to the unit on ISS, to conduct a ground-based investigation of the impact of the distance between the extruder tip and the build tray on material outcomes. This standoff distance was not held constant for the phase I flight prints and is hypothesized to be a major source of the material variability observed in the phase I data set.

Prater, T. J.↗

NASA NTRS2016

Summary Report on Phase I Results from the 3D Printing in Zero G Technology Demonstration Mission, Volume I

Human space exploration to date has been confined to low-Earth orbit and the Moon. The International Space Station (ISS) provides a unique opportunity for researchers to prove out the technologies that will enable humans to safely live and work in space for longer periods of time and venture beyond the Earth/Moon system. The ability to manufacture parts in-space rather than launch them from Earth represents a fundamental shift in the current risk and logistics paradigm for human spaceflight. In September 2014, NASA, in partnership with Made In Space, Inc., launched the 3D Printing in Zero-G technology demonstration mission to explore the potential of additive manufacturing for in-space applications and demonstrate the capability to manufacture parts and tools on orbit using fused deposition modeling. This Technical Publication summarizes the results of testing to date of the ground control and flight prints from the first phase of this ISS payload.

in-space manufacturing↗

NASA NTRS2014

Salt Spray Test to Determine Galvanic Corrosion Levels of Electroless Nickel Connectors Mounted on an Aluminum Bracket

During preliminary vehicle design reviews, requests were made to change flight termination systems from an electroless nickel (EN) connector coating to a zinc-nickel (ZN) plating. The reason for these changes was due to a new NASA-STD-6012 corrosion requirement where connectors must meet the performance requirement of 168 hr of exposure to salt spray. The specification for class F connectors, MIL-DTL-38999, certifies the EN coating will meet a 48-hr salt spray test, whereas the ZN is certified to meet a 168-hr salt spray test. The ZN finish is a concern because Marshall Space Flight Center has no flight experience with ZN-finished connectors, and MSFC-STD-3012 indicates that zinc and zinc alloys should not be used. The purpose of this test was to run a 168-hr salt spray test to verify the electrical and mechanical integrity of the EN connectors and officially document the results. The salt spray test was conducted per ASTM B117 on several MIL-DTL-38999 flight-like connectors mounted to an aluminum 6061-T6 bracket that was alodined. The configuration, mounting techniques, electrical checks, and materials used were typical of flight and ground support equipment.

Rolin, T. D.↗

NASA NTRS2012

Systematic Destruction of Electronic Parts for Aid in Electronic Failure Analysis

NASA analyzes electrical, electronic, and electromechanical (EEE) parts used in space vehicles to understand failure modes of these components. Operational amplifiers and transistors are two examples of EEE parts critical to NASA missions that can fail due to electrical overstress (EOS). EOS is the result of voltage or current over time conditions that exceeds a component s specification limit. The objective of this study was to provide known voltage pulses over well-defined time intervals to determine the type and extent of damage imparted to the device. The amount of current was not controlled but measured so that pulse energy was determined. The damage was ascertained electrically using curve trace plots and optically using various metallographic techniques. The resulting data can be used to build a database of physical evidence to compare to damaged components removed from flight avionics. The comparison will provide the avionics failure analyst necessary information about voltage and times that caused flight or test failures when no other electrical data is available.

Decker, S. E.↗

NASA NTRS2010

Three-Dimensional Computed Tomography as a Method for Finding Die Attach Voids in Diodes

NASA analyzes electrical, electronic, and electromechanical (EEE) parts used in space vehicles to understand failure modes of these components. The diode is an EEE part critical to NASA missions that can fail due to excessive voiding in the die attach. Metallography, one established method for studying the die attach, is a time-intensive, destructive, and equivocal process whereby mechanical grinding of the diodes is performed to reveal voiding in the die attach. Problems such as die attach pull-out tend to complicate results and can lead to erroneous conclusions. The objective of this study is to determine if three-dimensional computed tomography (3DCT), a nondestructive technique, is a viable alternative to metallography for detecting die attach voiding. The die attach voiding in two- dimensional planes created from 3DCT scans was compared to several physical cross sections of the same diode to determine if the 3DCT scan accurately recreates die attach volumetric variability

Brahm, E. N.↗

NASA NTRS2008

X-ray Fluorescence Spectroscopy Study of Coating Thickness and Base Metal Composition

For electrical, electronic, and electromechanical (EEE) parts to be approved for space use, they must be able to meet safety standards approved by NASA. A fast, reliable, and precise method is needed to make sure these standards are met. Many EEE parts are coated in gold (Au) and nickel (Ni), and the thickness coating is crucial to a part s performance. A nondestructive method that is efficient in measuring coating thickness is x-ray fluorescence (XRF) spectroscopy. The XRF spectrometer is a machine designed to measure layer thickness and composition of single or multilayered samples. By understanding the limitations in the collection of the data by this method, accurate composition and thickness measurements can be obtained for samples with Au and Ni coatings. To understand the limitations of data found, measurements were taken with the XRF spectrometer and compared to true values of standard reference materials (SRM) that were National Institute of Standards and Technology (NIST) traceable. For every sample, six different parameters were varied to understand measurement error: coating/substrate combination, number of layers, counting interval, collimator size, coating thickness, and test area location. Each measurement was taken in accordance with standards set by the American Society for Testing and Materials (ASTM) International Standard B 568.

Rolin, T. D.↗

NASA NTRS2008

Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

Rolin, T. D.↗

NASA NTRS1995

Determination of the electrical conductivity of liquid Ge(0.95)Si(0.05)

We have measured the electrical conductivity of molten germanium-silicon Ge(0.95)Si(0.05) from the liquidus temperature (1050 C) up to 1220 C. The data were acquired with a unique apparatus which utilizes the standard four-probe technique. The basic unit consists of a fused silica enclosure that contains hermetic glass-to-tungsten seals that can support vacuum pressures down to 10(exp -7) Torr. With calibration, the measurement error for the low vapor pressure materials of this study was typically less than 7%. The temperature dependence of the electrical conductivity of a Ge(0.95)Si(0.05) melt was found to vary from approximately 22,300/ohm/cm at the liquidus temperature down to approximately 16,000/ohm/cm at 1220 C. The negative temperature coefficient as well as the magnitude of these data clearly indicate that the molten material is metallic in nature despite the semiconducting properties of the solid.

Rolin, T. D.↗

NASA NTRS1988

High-temperature processing of cuprate oxide superconductors

Superconducting Y1Ba2Cu3O7 ('123') films were fabricated on the Y2BaCuO5 ('211') phase substrate. The superconducting characteristics of these films, in terms of superconducting transition temperature (Tc) and width, are better than those using other oxide compounds as substrates. In addition, using high-temperature processing, the bulk 211 phase was converted into the 123 phase. A new high Tc copper oxide material with non-rare-earth elements (Bi-Sr-Cu-O) was prepared using similar high-temperature processing. High-temperature processing presents an alternative synthetic route in the search of new high Tc superconductors.

Wu, M. K.↗