Engineering topics
Publications and source records attributed to Saunier, P..
A three-stage heterostructure FET monolithic amplifier has achieved a power-added efficiency of 36 percent with 200 mW output and 18 dB gain at 31 GHz. At a higher drain voltage, the output power increases to 280 mW (with 17.5 dB gain and 31 percent PAE) at a power density of 0.7 W/mm. The MMIC chip measures 2.63 x 1.35 sq mm and requires only a single drain bias and a single gate bias.
AlGaAs/InGaAs/GaAs-type heterostructures with one or two channels have been used to fabricate both discrete devices and monolithic amplifiers for millimeter-wave operation. The authors report that 0.25-micron x 50-micron discrete devices delivered a power density of 1 W/mm with 2.9-dB gain and 25 percent efficiency at 60 GHz. A 100-micron monolithic single-stage amplifier demonstrated a record 40 percent efficiency at 32 GHz, and a two-stage monolithic amplifier achieved a record 31.3 percent efficiency with 72-mW power and 13-dB gain at 32 GHz.
A four-way monolithic GaAs traveling-wave power divider/combiner has been designed, fabricated and evaluated. With a design center frequency of 20 GHz, a bandwidth of from 10 GHz to 30 GHz has been measured. The insertion loss per dividing or combining action is less than 0.5 dB, with isolation between ports no worse than 20 dB. The input/output VSWRs are better than 2:1 across the same band. This divider/combiner can readily be used with monolithic GaAs power FET amplifiers to produce a several-fold increase in output powers over the 10 to 30 GHz frequency range.
A high-frequency equivalent-circuit model of a GaAs dual-gate FET and analytical expressions for the input/output impedances, transconductance, unilateral gain, and stability factor are presented. It is found that the gain of a dual-gate FET is higher than of a single-gate FET at low frequency but decreases faster as frequency increases because of the capacitive shunting effect of the second gate. A dual-gate power FET suitable for variable-gain-amplifier applications up to K-band has been developed. At 10 GHz, a 1.2-mm-gatewidth device has achieved an output power of 1.1 W with 10.5-dB gain and 31-percent power-added efficiency. At 20 GHz, the same device delivered an output power of 340 mW with 5.3-dB gain. At K-band, a dynamic-gain control range of up to 45 dB was obtained with an insertion phase change of no more than + or 2 degrees for the first 10 dB of gain control.
Sixteen 30 dB 0.5 W amplifier modules were combined to satisfy the requirement for a graceful degradation. If one module fails, the output power drops by only 0.43 dB. Also, by incorporating all the gain stages within the combiner the overall combining efficiency is maximized. A 16 way waveguide divider combiner was developed to minimize the insertion loss associated with such a large corporate feed structure. Tests showed that the 16 way insertion loss was less than 0.5 dB. To minimize loss, a direct transition from waveguide to microstrip, using a finline on duroid substrate, was developed. The FETs fabricated on MBE grown material, demonstrated superior performances. For example, a 600 micrometer device was capable of 320 mW output power with 5 dB gain and 26.6% efficiency at 21 GHz. The 16 module amplifier gave 8.95 W saturated output power with 30 dB gain. The overall efficiency was 9%. The 3 dB bandwidth was 2.5 GHz. At 17.7 GHz the amplifier had 5 W output power and at 20.2 GHz it still had 4.4 W.
The maturity of the molecular beam epitaxy (MBE) technique for preparing device quality GaAs material for microwave applications is demonstrated by the excellent performance characteristics of K-band GaAs power field-effect transistors (FETs) fabricated on the MBE wafers. An output power of 710 mW with 4.5-dB gain and 17.7 percent power-added efficiency was achieved at 21 GHz with a 1.26-mm gate width pi-gate device. A similar device with a 0.56-mm gate width produced an output power of 320 mW with 5.0-dB gain and 26.6 percent power-added efficiency at 21 GHz. These are the best results yet reported to date for GaAs power FETs operated in the K-band frequency range.
This paper describes the fabrication and application of GaAs FET's, both as discrete microwave devices and as the key active components in monolithic microwave integrated circuits. The performance of these devices and circuits is discussed for frequencies ranging from 3 to 25 GHz. The crucial fabrication step is the formation of the submicron gate by electron-beam lithography.
The design, fabrication and performance of a TTL compatible 4-bit GaAs integrated digital-to-analog convertor with an output voltage between -2.8 V and +2.8 V are reported. This circuit has been especially designed to control the gain of power dual-gate FETs by applying a voltage on the capacitively terminated second gate.