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DOE OSTI2023

Motor with Advanced Concepts for High power density and INtegrated cooling for Efficiency (MACHINE)

Raytheon Technologies Research Center (RTRC) is the central research and development (R&D) organization for RTX, and has extensive expertise in the design, modeling and analysis of high-performance electrical machines and thermal management for all its business units. The proposing team consists of researchers from RTRC and John Deere (JD), will be referred as “Team”. Each organization a has long track record of successful R&D of materials, manufacturing, components, and systems for energy efficiency applications. Motor power density and efficiency are limited by fundamental physical trade-offs between electromagnetics, thermal management, and structural design considerations. The team is proposing to utilize novel technologies and multi-physics design methods to develop a Motor with Advanced Concepts for High power density and INtegrated cooling for Efficiency (MACHINE), demonstrating an 8X improvement in power density.

33 ADVANCED PROPULSION SYSTEMS↗

DOE OSTI2023

Hierarchical thermal-conductive polymer nanocomposites for thermal management

Managing heat in electrical conductors is a major challenge to meet the demands for sustainable energy use and electrical reliability, most notably power electronics and energy-critical electrical machines. Achieving such disparate functionalities, such as high temperature thermal and electrical reliability, require rational design and manufacturing of thermal conductor material and its hierarchical structures. Here we present hierarchical thermal-conductive nanocomposites, consisting of nanostructured ceramic conformal coating and aligned ultrahigh molecular weight polyethylene fiber, to tailor heat dissipation in electric conductors. The hybrid aligned thermal interface exhibits a highly desirable temperature dependent anisotropic high thermal conductivity with 0.98W m –1 K –1 and dielectric strength with 3.4. In addition, electrically insulating thermal interfaces demonstrate high-performing and reliable electrical systems under the dynamic load conditions. The surface temperature of heterogeneous ceramic-polymer encapsulated conductor is 17.8 °C lower than that of polymer-encapsulated conductor at the same electrical load. Consequently, the findings shown here hold great promises for directing heat extraction in electrical machine systems, advancing thermal management for emerging electronic applications.

36 MATERIALS SCIENCE↗