Apparatus and method for separating a semiconductor wafer Patent
Separation of semiconductor wafer into chips bounded by scribe lines
Litant, I.↗
Engineering topics
Scapicchio, A. J.
Publications and source records attributed to Scapicchio, A. J..
Improved method of dicing integrated circuit wafers into chips
Method employing a pressure chamber is used for dicing semiconductor single-crystal wafers, containing integrated circuits, into small chips along pre-scribed lines. Uniform bending of the scribed wafer over the convex surface of a perforated hemisphere, breaks it cleanly into individual chips without damaging the circuits.
Litant, I.↗