Spacecraft avionics miniaturization using embedded passive packaging technology
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Avionics packaging↗
Engineering topics
Schatzel, D.
Publications and source records attributed to Schatzel, D..
Heterogenous assembly of a MEMS neuro-prosthetic system
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heterogenous assembly MEMS neuro-prosthetic flip c↗
Heterogeneous integration, an approach to high density flexibility
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gh density electronic packaging integration↗