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Scott Thomas

Publications and source records attributed to Scott Thomas.

Thermocapillary flow and gaseous convection in microgravity: Results from GAS payload G-0518

Thermocapillary flow and gaseous convection in microgravity were investigated in GAS payload G-0518 during Space Shuttle Mission 41-D. A cylinder of paraffin was supported and heated differentially from its ends to induce a melt from solid to liquid and drive thermocapillary flow in the resulting liquid phase. Laminar thermocapillary flow was observed in the liquid paraffin and found to show a transition to time-dependent oscillatory motion at a Marangoni number of about Ma = 34000 with a period of approximately T = 8 seconds. In addition, free convection in a gas in microgravity was observed for the first time. The gaseous convection was caused by the thermal and/or velocity boundary layers present at the heater-liquid interface. Oscillation occurred in the gaseous convection simultaneously with those in the liquid, implying the two are strongly coupled. The gaseous convection may be driven by coupled thermocapillary flow/thermal expansion convection or microgravity bouyancy convection.

Scott Thomas↗

SR-1 Freedom Thermal Architecture Challenges

The SR-1 Freedom mission aims to demonstrate nuclear electric propulsion (NEP) and deliver the Skyfall helicopter payload to Mars. Repurposing the existing Gateway Power and Propulsion Element (PPE) spacecraft and combining it with a 20 kWe-class nuclear power module (NPM) presents a variety of thermal architecture challenges. These include unprecedented waste heat rejection requirements, integration with a spacecraft bus originally designed for a different mission profile, and novel packaging constraints. This presentation will describe the simplified concept of operations as it relates to on-orbit thermal environments, early-phase architecture trades and supporting analyses, and planned forward work. We will also discuss our strategy for integrated thermal modeling of the complete spacecraft and examples of interface challenges necessitated by this ambitious effort.

Thermal↗