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Shalkhauser, K. A.

Publications and source records attributed to Shalkhauser, K. A..

An optically controlled Ka-band phased array antenna

The design and development of a small, optically controlled phased array antenna suitable for communication satellite applications are discussed. A vertical integration architecture is used which minimizes the size of the array with its associated beamforming network (BFN). The antenna features a four-element linear microstrip array that uses aperture coupling of the antenna elements to the BFN; a modified Wilkinson power divider BFN; and 32 GHz, four-bit monolithic microwave integrated circuit (MMIC) phase shifters in customized quartz packages with corresponding optoelectronic interface circuits (OEIC's) for control signal reception.

Kunath, R. R.

High-performance packaging for monolithic microwave and millimeter-wave integrated circuits

Packaging schemes are developed that provide low-loss, hermetic enclosure for enhanced monolithic microwave and millimeter-wave integrated circuits. These package schemes are based on a fused quartz substrate material offering improved RF performance through 44 GHz. The small size and weight of the packages make them useful for a number of applications, including phased array antenna systems. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices.

Shalkhauser, K. A.

A vertically integrated Ka-band phased array antenna

The design, development, and experimental demonstration of a small phased array antenna suitable for applications on communications satellites are discussed. Each of the vertical layers was optimized for performance, and MMICs on custom carriers were characterized prior to insertion. A vertical integration architecture is used which minimizes the size of the array with its associated beamforming network (BFN). The antenna features a four-element linear microstrip array that uses aperture coupling of the antenna elements to the BFN; a modified Wilkinson power divider BFN; and 32 Ghz, 4-bit MMIC phase shifters on customized alumina carriers. Performance data are presented for all components, and far-field antenna radiation patterns are given.

Kunath, R. R.

High-performance packaging for monolithic microwave and millimeter-wave integrated circuits

Packaging schemes were developed that provide low-loss, hermetic enclosure for advanced monolithic microwave and millimeter-wave integrated circuits (MMICs). The package designs are based on a fused quartz substrate material that offers improved radio frequency (RF) performance through 44 gigahertz (GHz). The small size and weight of the packages make them appropriate for a variety of applications, including phased array antenna systems. Packages were designed in two forms; one for housing a single MMIC chip, the second in the form of a multi-chip phased array module. The single chip array module was developed in three separate sizes, for chips of different geometry and frequency requirements. The phased array module was developed to address packaging directly for antenna applications, and includes transmission line and interconnect structures to support multi-element operation. All packages are fabricated using fused quartz substrate materials. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices. The package and test fixture designs were both developed in a generic sense, optimizing performance for a wide range of possible applications and devices.

Shalkhauser, K. A.

Submicron gate InP power MISFET's with improved output power density at 18 and 20 GHz

The microwave characteristics are presented at 18 and 20 GHz of submicron gate indium phosphide (InP) metal-insulator-semiconductor field-effect transistors (MISFET's) for high output power density applications. InP power MISFET's were fabricated and the output power density was investigated as a function of drain-source spacing. The best output power density and gain were obtained for drain-source spacing of 3 microns. The output power density is 2.7 times greater than was previously measured for InP MISFET's at 18 and 20 GHz, and the power-added efficiency also increased.

Biedenbender, M. D.

System-Level Integrated Circuit (SLIC) development for phased array antenna applications

A microwave/millimeter wave system-level integrated circuit (SLIC) being developed for use in phased array antenna applications is described. The program goal is to design, fabricate, test, and deliver an advanced integrated circuit that merges radio frequency (RF) monolithic microwave integrated circuit (MMIC) technologies with digital, photonic, and analog circuitry that provide control, support, and interface functions. As a whole, the SLIC will offer improvements in RF device performance, uniformity, and stability while enabling accurate, rapid, repeatable control of the RF signal. Furthermore, the SLIC program addresses issues relating to insertion of solid state devices into antenna systems, such as the reduction in number of bias, control, and signal lines. Program goals, approach, and status are discussed.

Shalkhauser, K. A.

System-level integrated circuit (SLIC) development for phased array antenna applications

A microwave/millimeter wave system-level integrated circuit (SLIC) being developed for use in phased array antenna applications is described. The program goal is to design, fabricate, test, and deliver an advanced integrated circuit that merges radio frequency (RF) monolithic microwave integrated circuit (MMIC) technologies with digital, photonic, and analog circuitry that provide control, support, and interface functions. As a whole, the SLIC will offer improvements in RF device performance, uniformity, and stability while enabling accurate, rapid, repeatable control of the RF signal. Furthermore, the SLIC program addresses issues relating to insertion of solid state devices into antenna systems, such as the reduction in number of bias, control, and signal lines. Program goals, approach, and status are discussed.

Shalkhauser, K. A.

Bit-error-rate testing of fiber optic data links for MMIC-based phased array antennas

The measured bit-error-rate (BER) performance of a fiber optic data link to be used in satellite communications systems is presented and discussed. In the testing, the link was measured for its ability to carry high burst rate, serial-minimum shift keyed (SMSK) digital data similar to those used in actual space communications systems. The fiber optic data link, as part of a dual-segment injection-locked RF fiber optic link system, offers a means to distribute these signals to the many radiating elements of a phased array antenna. Test procedures, experimental arrangements, and test results are presented.

Shalkhauser, K. A.

Bit error rate testing of fiber optic data links for MMIC-based phased array antennas

The measured bit-error-rate (BER) performance of a fiber optic data link to be used in satellite communications systems is presented and discussed. In the testing, the link was measured for its ability to carry high burst rate, serial-minimum shift keyed (SMSK) digital data similar to those used in actual space communications systems. The fiber optic data link, as part of a dual-segment injection-locked RF fiber optic link system, offers a means to distribute these signals to the many radiating elements of a phased array antenna. Test procedures, experimental arrangements, and test results are presented.

Shalkhauser, K. A.

RF Testing Of Microwave Integrated Circuits

Fixtures and techniques are undergoing development. Four test fixtures and two advanced techniques developed in continuing efforts to improve RF characterization of MMIC's. Finline/waveguide test fixture developed to test submodules of 30-GHz monolithic receiver. Universal commercially-manufactured coaxial test fixture modified to enable characterization of various microwave solid-state devices in frequency range of 26.5 to 40 GHz. Probe/waveguide fixture is compact, simple, and designed for non destructive testing of large number of MMIC's. Nondestructive-testing fixture includes cosine-tapered ridge, to match impedance wavequide to microstrip. Advanced technique is microwave-wafer probing. Second advanced technique is electro-optical sampling.

Romanofsky, R. R.

RF characterization of monolithic microwave and mm-wave ICs

A number of fixturing techniques compatible with automatic network analysis are presented. The fixtures are capable of characterizing GaAs Monolithic Microwave Integrated Circuits (MMICs) at K and Ka band. Several different transitions are used to couple the RF test port to microstrip. Fixtures which provide chip level de-embedding are included. In addition, two advanced characterization techniques are assessed.

Romanofsky, R. R.

Test results for 20-GHz GaAs FET spacecraft power amplifier

Test were conducted to measure the performance of the 20-GHz solid state, proof-of-concept amplifier. The amplifier operates over the 17.7 to 20.2-GHz frequency range and uses high power gallium arsenide field effect transistors. The amplifier design and test methods are briefly described. NASA and contractor performance data are compared.

Shalkhauser, K. A.

Automated testing of developmental satellite communications systems and subsystems

Lower frequency bands allocated for satellite communications use are becoming saturated due to steadily increasing demand. An ongoing program to develop the new technologies required to meet the demands of future systems is described. Higher frequency components and more efficient system techniques are developed. In order to accurately evaluate the performance of these technologies, an automated test system was designed and built. The automated system's design an capabilities are discussed.

Shalkhauser, K. A.