Engineering topics

Shanks, K. S.

Publications and source records attributed to Shanks, K. S..

3 records

DOE OSTI2022

Characterization of 128 × 128 MM-PAD-2.1 ASIC: a fast framing hard x-ray detector with high dynamic range

Here, we characterize a new x-ray Mixed-Mode Pixel Array Detector (MM-PAD-2.1) Application Specific Integrated Circuit (ASIC). Using an integrating pixel front-end with dynamic charge removal architecture, the MM-PAD-2.1 ASIC extends the maximum measurable x-ray signal (in 20 keV photon units) to > 10 7 x-rays/pixel/frame while maintaining a low read noise across the full dynamic range, all while imaging continuously at a frame rate of up to 10 kHz. The in-pixel dynamic charge removal mechanism prevents saturation of the input amplifier and proceeds in parallel with signal integration to achieve deadtime-less measurements with incident x-ray rates of > 10 10 x-rays/pixel/s. The ASIC format consists of 128 × 128 square pixels each 150 μm on a side and is designed to be 3-side buttable so large arrays can be effectively tiled. Here we use both laboratory x-ray sources and the Cornell High Energy Synchrotron Source (CHESS) to characterize two single ASIC prototype detectors for both low (single x-ray) and high incident flux detection. In the first detector the ASIC was solder bump-bonded to a 500 μm thick Si sensor for efficient detection of x-rays below 20 keV, whereas the second detector used a 750 μm thick CdTe sensor for x-rays above ~20 keV.

36 MATERIALS SCIENCE↗

DOE OSTI2020

Characterization of an architecture for front-end pixel binning in an integrating pixel array detector

Optimization of an area detector involves compromises between various parameters like frame rate, read noise, dynamic range and pixel size. We have implemented and tested a novel front-end binning design in a photon-integrating hybrid pixel array detector using the MM-PAD- 2.0 pixel architecture. In this architecture, the pixels can be optionally binned in a 2 x 2 pixel configuration using a network of switches to selectively direct the output of 4 sensor pixels to a single amplifier input. Doing this allows a trade-off between frame rate and spatial resolution. Tests show that the binned pixels perform well, but with some degradation on performance as compared to an un-binned pixel. The increased parasitic input capacitance does reduce the signal collected per x-ray as well as increases the noise of the pixel. Here, the increase in noise is, however, less than the factor of 2 increase one would observe for binning in post-processing. Spatial scans across the binned pixels show that no measured signal intensity is lost at the inner binning unit boundaries. In the high flux regime, at a 2 x 2 pixel wide beam spot (FWHM) size, binned mode responds linearly up to a photon flux of 10 7 x-rays/s, and performs comparably with un-binned mode up to a photon flux of 10 8 x-rays/s. While this study demonstrates a proof of concept for front-end binning in integrating detectors, we also identify changes to this early-stage prototype which can further improve the performance of binning pixel structures.

47 OTHER INSTRUMENTATION↗

DOE OSTI2020

High dynamic range CdTe mixed-mode pixel array detector (MM-PAD) for kilohertz imaging of hard x-rays

A hard x-ray, high-speed, high dynamic range scientific x-ray imager is described. The imager is based on the mixed-mode pixel array detector (MM-PAD) readout chip coupled to a 750 µm thick cadmium telluride (CdTe) sensor. The full imager is a 2 × 3 tiled array of MM-PAD sensor/readout chip hybrids. CdTe improves detection for high energy x-rays as compared to silicon sensors, enabling efficient x-ray imaging to extend to >100 keV. The detector is capable of 1 kHz imaging and in-pixel circuitry has been designed to allow for well depths of greater than 4 × 10 6 80 keV x-rays. Here, a charge integrating front-end allows for quantitative measurement of high flux x-ray images beyond the capabilities of photon counting detectors. Detector performance is summarized and experimental measurements are presented.

99 GENERAL AND MISCELLANEOUS↗