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Shapiro, A. A.

Publications and source records attributed to Shapiro, A. A..

6 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2013

A Study of Solder Alloy Ductility for Cryogenic Applications

For aerospace applications it is important to understand the mechanical performance of components at the extreme temperature conditions seen in service. For solder alloys used in microelectronics, cryogenic temperatures can prove problematic. At low temperatures Sn-based solders undergo a ductile to brittle transition that leads to brittle cracks, which can result in catastrophic failure of electronic components, assemblies and spacecraft payloads. As industrial processes begin to move away from Pb-Sn solder, it is even more critical to characterize the behavior of alternative Sn-based solders. Here we report on initial investigations using a modified Charpy test apparatus to characterize the ductile to brittle transformation temperature of nine different solder systems.

solders↗
NASA NTRS2004

A Portable Universal Hazardous Gas Detector

Experimental work on the Miniature Mass Spectrometer (MMS) at JPL has resulted in a 'table top' configuration with a CCD detector that has demonstrated a detection limit of 50 parts per billion. The CCD detector operates at ambient temperature. Intelligent Ion, Inc., a commercial instrument developer, has taken out a license on the JPL technology and has built a prototype using a Faraday Cup Array detector as a placeholder detector. The prototype instrument was tested at Kennedy Space Center and demonstrated detection limits in the parts per million range. The test results are presented as well as detailed photographs of the prototype instrument. A presentation of the MMS was made to an expert review panel for 'On-Board Environmental Monitoring Systems for the International Space Station (ISS).' The scores obtained by the MMS system are presented. The prototype instrument will be retro fitted with a CCD array detector in August 2004 and will again be tested at KSC. The instrument is expected to show a detection level for hydrazines of 10 ppb and a detection level for solvents below 10 ppb.The expectations are based on raw data from the first batch of CCD's that was tested.

spacecraft fuels↗
NASA NTRS2003

Lead-free solders: issues of toxicity, availability and impacts of extraction

This project set out to evaluate the critical issues of toxicity and public health effects, material availability, and the environmental impacts of raw material extraction and metal finishing, with the goal of using environmental impact as a factor in selecting feasible lead-free alloys.

toxicity lead-free solder packaging↗
NASA NTRS2003

Implications of Pb-free microelectronics assembly in aerospace applications

The commercial microelectronics industry is rapidly moving to completely Pb-free assembly strategies within the next decade. This trend is being driven by existing and proposed legislation in Europe and in Japan. The microelectronics industry has become truly global, as indicated by major U .S. firms who already adopted Pb-free implementation programs. Among these forward-looking firms are AT&T, IBM, Motorola, HP and Intel to name a few.Following Moore's law, advances in microelectronics are happening very rapidly. In many cases, commercial industry is ahead of the aerospace sector in technology. Progress by commercial industry, along with cost, drives the use of Commercial Off-The-Shelf (COTS) parts for military and space applications. We can thus anticipate that the aerospace industry will, at some point, be forced to use Pb-free components and subsystems as part of their standard business practices. In this paper we attempt to provide a snapshot of the commercial industry trends and how they may impact electronics in the aerospace environment. In addition, we also look at different strategies for implementation. Finally we present data collected on a recent NASA project to focus on finding suitable alternatives to eutectic tin-lead solders and solder pastes. The world is moving toward implementation of environmentally friendly manufacturing techniques. The aerospace industry will be forced to deal with issues related with Pb free assembly, either by availability or legislation. This paper provides some insight into some of the tradeoffs that should be considered.

Pb-free electronics manufacturing↗