Engineering topics
Shapiro, Andrew
Publications and source records attributed to Shapiro, Andrew.
Qualification and Selection of Flight Diode Lasers for the NuSTAR Space Mission
No abstract available
Low temperature thermal cycle survivability and reliability study for brushless motor drive electronics (#1360)
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Reliability Assessment of Advanced Flip-clip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120 C)
Flip-chip interconnect electronic package boards have been assembled, underfilled, non-destructively evaluated and subsequently subjected to extreme temperature thermal cycling to assess the reliability of this advanced packaging interconnect technology for future deep space, long-term, extreme temperature missions. In this very preliminary study, the employed temperature range covers military specifications (-55 C to 100 C), extreme cold Martian (-120 C to 115 C) and asteroid Nereus (-180 C to 25 C) environments. The resistance of daisy-chained, flip-chip interconnects were measured at room temperature and at various intervals as a function of extreme temperature thermal cycling. Electrical resistance measurements are reported and the tests to date have not shown significant change in resistance as a function of extreme temperature thermal cycling. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work has been carried out to understand the reliability of flip-chip interconnect packages under extreme temperature applications (-190 C to 85 C) via continuously monitoring the daisy chain resistance. Adaptation of suitable diagnostic techniques to identify the failure mechanisms is in progress. This presentation will describe the experimental test results of flip-chip testing under extreme temperatures.
Reliability assessment of advanced flip-chip interconnect electronic package assemblies under extreme cold temperatures (-190 degrees C and -120 degrees C)
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Semiconductor lasers beyond the fiber optics telecommunication wavelength
Semiconductor lasers emitting at 1.55 microns are the cornerstone of the high bandwidth optical communications industry. Semiconductor lasers operating at this and other wavelengths are also used in the engineering, biology, chemistry and medical fields. The light emission in most semiconductor lasers is due to the optical transition between the valence and conduction bands of the semiconductor active material. This means that the intrinsic properties of the semiconductor active material i.e., the bandgap energy dictates the emission wavelength. This limits the efficient operation of these lasers at wavelengths above 3 microns. In the mid 1990s this limitation was overcome with the emergence of new laser architectures, such as the intersubband and interband Quantum Cascade (QC) lasers
The devil that we know: lead (Pb) replacement policies under conditions of scientific uncertainty
Engineering and economic considerations are typical driving forces behind the selection of specific chemicals used in the manufacture of consumer products. Only recently has post-consumer environmental impact become part of the major considerations during the initial phases of product design. Therefore, reactive, rather than proactive strategies have dominated the consideration of environmental and health issues in product design.