Engineering topics
Publications and source records attributed to Shier, J. S..
Contact preparation at low temperatures is possible with the use of a copper-titanium eutectic alloy. Contacts formed with this alloy are ohmic on p-type silicon carbide and rectifying on n-type.
Alloy contact layer is made at relatively low temperature and has good wetting characteristics. Contacts adhere well to silicon carbide surface, penetrating about 300 to 500 angstroms into it. Contacts are ohmic on p-type silicon carbide and blocking on n-type.
Al-Si and Cu-Ti eutectic alloys showing good ohmic contacts to SiC
Temperature dependent isomer shift and anharmonic binding of Sn 119 in niobium stannide, measuring Mossbauer recoil free fraction