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Smith, Ricky E.

Publications and source records attributed to Smith, Ricky E..

Low-Dielectric-Constant Polyimide/Glass Composites

Advance in polymer technology yields composites having relatively low dielectric constants. Reduction achieved by reducing interactions between linear polyimide chains and by incorporation of fluorine into polymer backbones. Further reductions obtained by physically incorporating selected diamic acid additives into polyimides. Strong potential for use in microelectronics industry for fabrication of printed-circuit boards and fabrication of components for military aircraft.

Stoakley, Diane M.↗

Freeze-Drying Makes Improved IPN And Semi-IPN Polymers

Novel process developed for production of interpenetrating polymer networks (IPN's) or semi-IPN's with greater fracture toughness and resistance to microcracks. Process controls degree of phase separation in IPN's. In experiment, IPN's and semi-IPN's formed by dissolving constituents in another common solvent in traditional method. Resins and composite materials produced were tested for both traditional and freeze-drying processes. Glass-transition temperatures and data from dynamic mechanical tests of freeze-dried IPN's and semi-IPN's demonstrated freeze-drying process provided much improved IPN's and semi-IPN's.

Pater, Ruth H.↗

LaRC-RP41: A Tough, High-Performance Composite Matrix

New polymer exhibits increased toughness and resistance to microcracking. Cross-linking PMR-15 and linear LaRC-TPI combined to provide sequential semi-2-IPN designated as LaRC-RP41. Synthesized from PMR-15 imide prepolymer undergoing cross-linking in immediate presence of LaRC-TPI polyamic acid, also undergoing simultaneous imidization and linear chain extension. Potentially high-temperature matrix resin, adhesive, and molding resin. Applications include automobiles, electronics, aircraft, and aerospace structures.

Pater, Ruth H.↗

New Polyimide Has Many Uses

Low-toxicity and low-mutogenicity monomer key to new high-performance polyimide. LaRC-IA is thermoplastic polyimide made from 3-4'-oxydianiline and 4,4'-oxydiphthalic anhydride. Good processing characteristics, low toxicity, and no mutagenicity. Adhesives, composite matrix resins, heat resin moldings, and coating films made of new polymer found to exhibit properties identical or superior to commercially available polyimides. Potential applications wide ranging. With and without end capping, employed to prepare unfilled moldings, coatings and free films, adhesive tape, adhesively bonded substrates, prepregs, and composites.

St. Clair, Terry L.↗