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Sokolowski, Witold M.

Publications and source records attributed to Sokolowski, Witold M..

Self-Deployable Membrane Structures

Currently existing approaches for deployment of large, ultra-lightweight gossamer structures in space rely typically upon electromechanical mechanisms and mechanically expandable or inflatable booms for deployment and to maintain them in a fully deployed, operational configuration. These support structures, with the associated deployment mechanisms, launch restraints, inflation systems, and controls, can comprise more than 90 percent of the total mass budget. In addition, they significantly increase the stowage volume, cost, and complexity. A CHEM (cold hibernated elastic memory) membrane structure without any deployable mechanism and support booms/structure is deployed by using shape memory and elastic recovery. The use of CHEM micro-foams reinforced with carbon nanotubes is considered for thin-membrane structure applications. In this advanced structural concept, the CHEM membrane structure is warmed up to allow packaging and stowing prior to launch, and then cooled to induce hibernation of the internal restoring forces. In space, the membrane remembers its original shape and size when warmed up. After the internal restoring forces deploy the structure, it is then cooled to achieve rigidization. For this type of structure, the solar radiation could be utilized as the heat energy used for deployment and space ambient temperature for rigidization. The overall simplicity of the CHEM self-deployable membrane is one of its greatest assets. In present approaches to space-deployable structures, the stow age and deployment are difficult and challenging, and introduce a significant risk, heavy mass, and high cost. Simple procedures provided by CHEM membrane greatly simplify the overall end-to-end process for designing, fabricating, deploying, and rigidizing large structures. The CHEM membrane avoids the complexities associated with other methods for deploying and rigidizing structures by eliminating deployable booms, deployment mechanisms, and inflation and control systems that can use up the majority of the mass budget

Sokolowski, Witold M.

Surface Control of Cold Hibernated Elastic Memory Self-Deployable Structure

A new class of simple, reliable, lightweight, low packaging volume and cost, self-deployable structures has been developed for use in space and commercial applications. This technology called 'cold hibernated elastic memory' (CHEM) utilizes shape memory polymers (SMP)in open cellular (foam) structure or sandwich structures made of shape memory polymer foam cores and polymeric composite skins. Some of many potential CHEM space applications require a high precision deployment and surface accuracy during operation. However, a CHEM structure could be slightly distorted by the thermo-mechanical processing as well as by thermal space environment Therefore, the sensor system is desirable to monitor and correct the potential surface imperfection. During these studies, the surface control of CHEM smart structures was demonstrated using a Macro-Fiber Composite (MFC) actuator developed by the NASA LaRC and US Army ARL. The test results indicate that the MFC actuator performed well before and after processing cycles. It reduced some residue compressive strain that in turn corrected very small shape distortion after each processing cycle. The integrated precision strain gages were detecting only a small flat shape imperfection indicating a good recoverability of original shape of the CHEM test structure.

glass transition temperature Tg

Medical applications of shape memory polymers

Shape memory polymers are described here and major advantages in some applications are identified over other medical materials such as shape memory alloys (SMA). A number of medical applications are anticipated for shape memory polymers. Some simple applications are already utilized in medical world, others are in examination process. Lately, several important applications are being considered for CHEM foams for self-deployable vascular and coronary devices. One of these potential applications, the endovascular treatment of aneurysm was experimentally investigated with encouraging results and is described in this paper as well.

cold hibernated elastic memory (CHEM)

Die Attachment for -120 C to +20 C Thermal Cycling of Microelectronics for Future Mars Rovers: An Overview

Active thermal control for electronics on Mars Rovers imposes a serious penalty in weight, volume, power consumption, and reliability. Thus, we propose that thermal control be eliminated for future Rovers. From a functional standpoint there is no reason that the electronics could not operate over the entire temperature range of the Martian environment, which can vary from a low of approximately equal -90 C to a high of approximately equal +20 C during the Martian night and day. The upper end of this range is well within that for conventional electronics. Although the lower end is considerably below that for which conventional--even high-reliability electronics is designed or tested, it is well established that electronic devices can operate to such low temperatures. The primary concern is reliability of the overall electronic system, especially in regard to the numerous daily temperature cycles that it would experience over the duration of a mission on Mars. Accordingly, key reliability issues have been identified for elimination of thermal control on future Mars Rovers. One of these is attachment of semiconductor die onto substrates and into packages. Die attachment is critical since it forms a mechanical, thermal and electrical interface between the electronic device and the substrate or package. This paper summarizes our initial investigation of existing information related to this issue, in order to form an opinion whether die attachment techniques exist, or could be developed with reasonable effort, to withstand the Mars thermal environment for a mission duration of approximately I year. Our conclusion, from a review of literature and personal contacts. is that die attachment can be made sufficiently reliable to satisfy the requirements of future Mars Rovers. Moreover, it appears that there are several possible techniques from which to choose and that the requirements could be met by judicious selection from existing methods using hard solders, soft solders, or organic adhesives. Thus from the standpoint of die attachment. it appears feasible to eliminate thermal control for Rover electronics. We recommend that this be further investigated and verified for the specific hardware and thermal conditions appropriate to Mars Rovers.

Kirschman, Randall K.

Ultra high purity, dimensionally stable INVAR 36

An INVAR 36 material having long-term dimensional stability is produced by sintering a blend of powders of nickel and iron under pressure in an inert atmosphere to form an alloy containing less than 0.01 parts of carbon and less than 0.1 part aggregate and preferably 0.01 part individually of Mn, Si, P, S and Al impurities. The sintered alloy is heat treated and slowly and uniformly cooled to form a material having a coefficient of thermal expansion of less than 1 ppm/C and a temporal stability of less than 1 ppm/year.

Sokolowski, Witold M.

Temporally And Thermally Stable Iron/Nickel Alloy

Specially prepared version of commerical low-thermal-expansion iron/nickel alloy exhibits unprecedented thermal and temporal dimensional stability. Consists of high-purity powder-metallurgy process followed by heat treatment. High-purity processing imparts unusual combination of properties.

Sokolowski, Witold M.

Ultra high purity, dimensionally stable INVAR 36

An INVAR 36 material having long-term dimensional stability is produced by sintering a blend of powders of nickel and iron under pressure in an inert atmosphere to form an alloy containing less than 0.01 parts of carbon and less than 0.1 part aggregate and preferably 0.01 part individually of Mn, Si, P, S and Al impurities. The sintered alloy is heat treated and slowly and uniformly cooled to form a material having a coefficient of thermal expansion of less than 1 ppm/C and a temporal stability of less than 1 ppm/year.

Sokolowski, Witold M.