Engineering topics

Spinella, Laura

Publications and source records attributed to Spinella, Laura.

9 records

DOE OSTI2023

Ribbons Affect Movement of Cracked Solar Cells [Poster]

Cracking of crystalline silicon photovoltaic cells remains a challenging topic in accurately assessing the long-term reliability and performance of affected modules. Cells can be damaged in every stage throughout the lifetime of a photovoltaic module, ranging from manufacturing, transportation, and installation to operation. Initially, the metallization can be able to bridge the gap of fractured cells and keep individual cell fragments electrically connected. However, photovoltaic modules and cells experience thermo-mechanical stresses during operation from temperature changes and pressure cycles of wind and snow loads. This causes the cell fragments to move, which, in turn, can lead to the wear out of the metallization and, consequently, to power loss or a safety hazard. The rate at which this degradation mechanism proceeds is currently unknown. Hence, in this work, we quantify the cell fragment movement of polycrystalline and monocrystalline mini-modules. By using digital image correlation, we were able to extract the normal crack opening and tangential sliding distances of adjacent cell fragments during heating of the mini-modules. Those distances are essential to develop wear-out models for the metallization and determine the rate of the degradation mechanism. We found that the interconnect technology has a significant impact on the direction and quantity of the cell fragment movements.

14 SOLAR ENERGY↗

DOE OSTI2022

Chemical and mechanical interfacial degradation in bifacial glass/glass and glass/transparent backsheet photovoltaic modules

Abstract Glass/glass (G/G) photovoltaic modules are quickly rising in popularity, but the durability of modern G/G packaging has not yet been established. In this work, we examine the interfacial degradation modes in G/G and glass/transparent backsheet modules under damp heat (DH) with and without system bias voltage, comparing emerging polyolefin elastomer (POE) and industry‐standard poly(ethylene‐co‐vinyl acetate) (EVA) encapsulants. We investigate the transport of ionic species at cell/encapsulant interfaces, demonstrating that POE limits both sodium and silver ion migration compared with EVA. Changes to the chemical structures of the encapsulants at the cell/encapsulant interfaces demonstrate that both POE and EVA are more susceptible to degradation in modules with a transparent backsheet than in the G/G configuration. Adhesion testing reveals that POE and EVA have comparable critical debond energies after the DH exposures regardless of system bias polarity. The results of this study indicate that the interfacial degradation mechanisms of G/G appear to be similar to those of conventional glass/backsheet modules. For emerging materials, our results demonstrate that POE offers advantages over EVA but that transparent backsheets may accelerate encapsulant degradation due to increased moisture ingress when compared with the G/G structure.

14 SOLAR ENERGY↗

DOE OSTI2021

Glass/glass photovoltaic module reliability and degradation: a review

Glass/glass (G/G) photovoltaic (PV) module construction is quickly rising in popularity due to increased demand for bifacial PV modules, with additional applications for thin-film and building-integrated PV technologies. G/G modules are expected to withstand harsh environmental conditions and extend the installed module lifespan to greater than 30 years compared to conventional glass/backsheet (G/B) modules. With the rapid growth of G/G deployment, understanding the outdoor performance, degradation, and reliability of this PV module construction becomes highly valuable. In this review, we present the history of G/G modules that have existed in the field for the past 20 years, their subsequent reliability issues under different climates, and methods for accelerated testing and characterization of both cells and packaging materials. We highlight some general trends of G/G modules, such as greater degradation when using poly(ethylene-co-vinyl acetate) (EVA) encapsulants, causing the industry to move toward polyolefin-based encapsulants. Transparent backsheets have also been introduced as an alternative to the rear glass for decreasing the module weight and aiding the effusion of trapped gaseous degradation products in the laminate. New amendments to IEC 61215 standard protocols for G/G bifacial modules have also been proposed so that the rear side power generation and UV exposure will be standardized. We further summarize a suite of destructive and non-destructive characterization techniques, such as current-voltage scans, module electro-optical imaging, adhesion tests, nanoscale structural/chemical investigation, and forensic analysis, to provide deeper insights into the fundamental properties of the module materials degradation and how it can be monitored in the G/G construction. This will set the groundwork for future research and product development.

14 SOLAR ENERGY↗

DOE OSTI2021

Thermomechanical fatigue resistance of low temperature solder for multiwire interconnects in photovoltaic modules

Novel interconnect technologies leveraging low melting temperature solders, such as multiwire interconnects, are being deployed in photovoltaic (PV) modules for improved reliability through interconnect redundancy and lower thermal loads during interconnection and lamination. However, the equivalency of standardized accelerated testing to field conditions has not yet been established for these emerging technologies. In this study, the thermomechanical fatigue resistance of low temperature solder alloys is investigated and compared to that of conventional SnPb to assess the acceleration behavior of these alloys. While InSn is shown to have sufficient thermomechanical fatigue resistance on the order of that of SnPb, these results indicate Sn–Bi alloys may have poor thermomechanical fatigue resistance at field conditions. The results also show that Sn–Bi alloys have thermal cycling acceleration factors of less than one. This indicates that the standardized accelerated thermal cycling test, such as that in IEC 61215, will produce misleading results for Sn–Bi alloys and that unique testing is required for this PV module architecture. Though accelerated thermal cycling may be a meaningful qualification test for SnPb solder joints, these results suggest that mechanical loading may be a more appropriate test for Sn–Bi multiwire interconnects. This is due to the distinct processing and geometry of multiwire interconnects which may allow for mechanical, rather than strictly metallurgical interconnections.

14 SOLAR ENERGY↗

DOE OSTI2019

Application of Electronics Packaging Fundamentals to Photovoltaic Interconnects and Packaging

The energy capacity of photovoltaic (PV) installations worldwide has increased significantly in the last decade, increasing the demand for rigorous investigation of the physical phenomena causing degradation and failures in PV modules. As PV reliability science develops, established methods and approaches from longer-standing industries can inform and expedite PV reliability advances. This work demonstrates how thermomechanical solder bond fatigue models derived for electronics packaging applications can be applied to both standard and emerging PV interconnect designs. This expertise cannot be directly translated to PV however, as target PV module lifetimes are significantly longer than most electronics and the modules must withstand the natural climate wherever they are deployed. Verification of analytical reliability models is then an additional challenge, due to model size, test time, and climate variability. Furthermore, unconventional materials, such as low-temperature solders, are now being integrated into PV designs, for which appropriate material models must be selected and material parameters derived. In this paper, the current state of PV interconnect research is explored, with an emphasis on the experimental and simulation approaches and models being used for this work. Recent results for standard module architectures as well as emerging interconnect schemes are discussed.

14 SOLAR ENERGY↗

DOE OSTI2019

Synchrotron X-Ray Microdiffraction Investigation of Scaling Effects on Reliability for Through-Silicon Vias for 3-D Integration

Synchrotron x-ray microdiffraction has been applied to TSV characterization in various studies for nondestructive inspection with submicron resolution due to its high beam intensity and penetration depth. Here, the application of this technique to TSV investigations is examined and the correlation of the plastic deformation to the microstructure and extrusion behavior along with the effect of TSV dimensional scaling is examined. It is shown that the variability of the copper microstructure and resulting TSV behavior requires a larger number of samples in order to report statistically significant observations. The role of the microstructure in creating statistical scatter is demonstrated through microdiffraction measurements of grain orientation correlated with the observed peak widening, which shows that degraded TSV reliability is largely due to the high elastic anisotropy of copper. After taking the statistical variations into account, the scaling effect was clearly observed, with larger plastic deformation in 2μm diameter TSVs than in 5μm diameter TSVs consistent with microstructure variations. This is confirmed by TSV extrusion measurements, which show that the magnitude and statistical spread of the via extrusion for the 2μm diameter TSVs is higher than that of the 5μm diameter TSVs. These findings, confirmed by thermomechanical simulation, demonstrate first that large sample sizes are required in copper TSV investigations due to high variability, which is not improved with scaling.

36 MATERIALS SCIENCE↗

DOE OSTI2019

FTIR Investigation of EVA Chemical Bonding Environment and Its Impact on Debond Energy

The chemical makeup of ethylene vinyl acetate (EVA) interfaces in photovoltaic (PV) modules is probed via Fourier-transform infrared spectroscopy (FTIR) to determine the impact of the EVA formulation on the adhesion degradation. EVA samples laminated with glass particles are used to demonstrate the effect of damp heat exposure on the glass-EVA interface, showing that increasing silane content increases chemical stability. Delamination interfaces created in one cell modules demonstrate a high correlation between the siloxane bonding at the silicon cell-EVA interface and the debond energy. A significant decrease in debond energy after UV exposure is also shown to be due in part to decreasing siloxane bond density at the interface. However, FTIR results indicated contributions to the adhesion beyond the chemical interface, and a basic tensile test indicates increasing bulk mechanical properties with increasing silane. These results demonstrate the importance of the EVA formulation on its adhesion performance and long-term reliability. Furthermore, it is shown that FTIR is a capable technique for assessing and quantifying chemical mechanisms within PV modules. These results can then be used to more effectively model module lifetimes and to better design polymer systems for PV modules.

14 SOLAR ENERGY↗

DOE OSTI2019

Microstructure Evolution and Effect on Resistivity for Cu Nanointerconnects and Beyond

In this paper, we investigate the microstructure evolution in Cu, Co and Ru nanointerconnects and the scaling effect on resistivity. The scaling effect on microstructure of Cu interconnects was analyzed to the 24 nm linewidth for the 14 nm node using a high-resolution TEM precession microdiffraction technique. The TEM study was supplemented by a Monte Carlo simulation to investigate grain growth in nanointerconnects based on local energy minimization. The scaling effect on electrical resistivity was analyzed for Cu, Ru and Co nanointerconnects, taking into account the contributions from surface and grain boundary scatterings. The results for Cu and Co are consistent with recent experiments.

36 MATERIALS SCIENCE↗

DOE OSTI2018

Microstructure Evolution and Implications for Cu Nanointerconnects and Beyond

The continued scaling of Cu low k technology is facing serious challenges imposed by basic limits from materials, processing and reliability. This has generated great interests recently to further develop Cu nanointerconnects and alternates, particularly Co and Ru nanointerconnects beyond the 10nm node. The performance and reliability are important considerations for the development of nanointerconnects in addition to challenges from processing complexity and manufacturing cost. In this paper, we investigate the microstructure evolution in Cu, Co and Ru nanointerconnects and the effects on resistivity and electromigration (EM), two key factors contributing to the RC delay and reliability of the nanointerconnects.

36 MATERIALS SCIENCE↗