Thermal Characterization of Epoxy Adhesive by Hotfire Testing
This paper describes subscale solid-rocket motor hot-fire testing of epoxy adhesives in flame surface bondlines to evaluate heat-affected depth, char depth and ablation rate. Hot-fire testing is part of an adhesive down-selection program on the Space Shuttle Solid Rocket Motor Nozzle to provide additional confidence in the down-selected adhesives. The current nozzle structural adhesive bond system is being replaced due to obsolescence. Prior to hot-fire testing, adhesives were tested for chemical, physical and mechanical properties, which resulted in the selection of two potential replacement adhesives, Resin Technology Group's TIGA 321 and 3M's EC2615XLW. Hot-fire testing consisted of four forty-pound charge (FPC) motors fabricated in configurations that would allow side-by-side comparison testing of the candidate replacement adhesives with the current RSRM adhesives. Results of the FPC motor testing show that: 1) the phenolic char depths on radial bondlines is approximately the same and vary depending on the position in the blast tube regardless of which adhesive was used, 2) the replacement candidate adhesive char depths are equivalent to the char depths of the current adhesives, 3) the heat-affected depths of the candidate and current adhesives are equivalent, and 4) the ablation rates for both replacement adhesives were equivalent to the current adhesives.