Engineering topics
Publications and source records attributed to St. Clair, A. K..
Report describes experimental study of permeabilities, by each of five gases, of membranes made of four different polyimides. Conducted to gain understanding of effects of molecular structures of membranes on permeabilities and to assess potential for exploitation of selective permeability in gas-separation processes. Gases used: H2, O2, N2, CO2, and CH4.
Polyimides have become widely used as high performance polymers as a result of their excellent thermal stability and toughness. However, lowering their coefficient of thermal expansion (CTE) would increase their usefulness for aerospace and electronic applications where dimensional stability is a requirement. The incorporation of metal ion-containing additives into polyimides, resulting in significantly lowered CTE's, has been studied. Various metal ion additives have been added to both polyamic acid resins and soluble polyimide solutions in the concentration range of 4-23 weight percent. The incorporation of these metal ions has resulted in reductions in the CTE's of the control polyimides of 12 percent to over 100 percent depending on the choice of additive and its concentration.
NASA-Langley studies of polymer structure-property relationships have led to the development of a method for the reduction of dielectric constants in polyimides through chemical alterations of polymer backbone composition to reduce chain-chain electronic interactions, as well as through the incorporation of fluorine atoms into the polymer molecular structure. Still-greater dielectric constant reductions are obtainable by means of a physical incorporation of diamic acid additives into these low-dielectric polyimide systems; the resulting thermoplastic resins are applicable to polymer matrices for composite structural materials.
High-temperature linear aromatic polyimide with improved resistance to tearing made by new process that incorporates elastomer into polyimide. Linear aromatic condensation polyimides are materials of prime choice for use as films and coatings on advanced spacecraft and aircraft where durability at temperatures in range of 200 to 300 degree C required. Elastomer-containing polyimide film with improved toughness proves useful for applications where resistance to tearing and long-term thermal stability necessary. Desired resistance to tearing achieved by careful control of amount and chemical composition of added elastomer.
Tough, optically transparent films produced. Polyimides having this molecular structure form tough, transparent films. Films made transparent by careful control of manufacturing conditions, including use of highly purified monomers. Need for high-temperature, flexible polymeric films and coating materials that have high optical transparency in 300- to 600nm range of electro-magnetic spectrum for use on antennas, solar cells, and thermalcontrol coatings.
Broad spectrum of thermosetting epoxy resins used on commercial and military aircraft, primarily as composite matrices and adhesives. In new technique, chromium-ion containing epoxy with improved resistance to moisture produced where chromium ions believed to prevent absorption of water molecules by coordinating themselves to hydroxyl groups on epoxy chain. Anticipated that improved epoxy formulation useful as composite matrix resin, adhesive, or casting resin for applications on commercial and advanced aircraft. Improvement made without sacrifice in mechanical properties of polymer.
New process yields aromatic condensation polyimide films essentially colorless. Films between 90- and 100-percent transparent at visible wavelength of 500 nm. Optically transparent polyimide films made from variety of aromatic condensation polyimides. Range from very pale in color to colorless, compared to bright yellow color of conventional/ commercial aromatic polyimide film. Increased transparency achieved at no sacrifice in thermal stability, flexibility, toughness, or mechanical properties. These features extremely attractive as films or coating materials for aerospace applications or for any other applications where high optical transparency or thermal stability is required.
Technique developed for improving mechanical strength of epoxy resins by adding cobalt ions in form of tris(acetylacetonato)cobalt (III) complex. Solid cast disks prepared from cobalt ion-containing epoxy resins tested for flexural strength and stiffness. Incorporation of cobalt ions into epoxies increased flexural strength of resins by 10 to 95 percent. Suitable resins for this technique include any liquid or solid TGMDA resins. Improved epoxy formulation proves useful as composite matrix resin, adhesive, or casting resin for applications on commercial and advanced aircraft.
A series of essentially colorless aromatic polyimide films was synthesized and characterized with the objective of obtaining maximum optical transparency for applications in space. Optical transparency is a requirement for high performance polymeric films used in second surface mirror coatings on thermal control systems. The intensity in color of aromatic polyimide films was lowered by reducing the electronic interaction between chromophoric centers in the polymer molecular structure and by using highly purified monomers. The resulting lightly colored to colorless polyimide films were characterized by UV-visible and infrared spectroscopy before and after exposure to 300 equivalent solar hours UV irradiation and varying doses of 1 MeV electron irradiation. After irradiation, the films were found to be 2 to 2.5 times more transparent than commercial polyimide film of the same thickness.
A series of essentially colorless aromatic polyimide films has been synthesized and characterized with the objective of obtaining maximum optical transparency for applications in space. Optical transparency is a requirement for high performance polymeric films used in second surface mirror coatings on thermal control systems. The intensity in color of aromatic polyimide films was lowered by reducing the electronic interaction between chromophoric centers in the polymer molecular structure and by using highly purified monomers. The resulting lightly colored to colorless polyimide films have been characterized by UV-visible and infrared spectroscopy before and after exposure to 300 equivalent solar hours UV irradiation and varying doses of 1 MeV electron irradiation. After irradiation, the films were found to be 2 to 2.5 times more transparent than commercial polyimide film of the same thickness.
The incorporation of specific metal ions into polyimides is described. Detailed studies have included various compounds of copper, lithium, and palladium as dopants. Addition of the metal during polymermzation or after formation of the polyamic acid precedes the thermal imidization step. With many dianhydride-diamine-dopant combinations high quality variously colored films are produced. Many metal doped films exhibit (1) improved high temperature adhesive properties, (2) increased electrical conductivity, (3) excellent thermal stability, (4) improved acid/base resistance, (5) increased modulus in flexible films and (6) excellent high temperature tensile strength. X-ray photo-electron spectroscopic study of these films suggests that many of the additives undergo chemical modification during thermal imidization. Palladium dopants appear to be partially reduced to the metallic state, while lithium and copper dopants are probably converted to their oxides. Ion etching experiments with Auger electron spectroscopy monitoring are discussed.
Few materials are available which can be used as aerospace adhesives at temperatures in the range of 300 C. The Materials Division at NASA-Langley Research Center developed several high temperature polyimide adhesives to fulfill the stringent needs of current aerospace programs. These adhesives are the result of a decade of basic research studies on the structure property relationships of both linear and addition aromatic polyimides. The development of both in house and commercially available polyimides is reviewed with regards to their potential for use as aerospace adhesives.
A series of studies evaluating the effects of added elastomers on the properties of a high-temperature addition polyimide adhesive is reviewed. First, thermoset polyimides containing various butadiene/acrylonitrile and silicone elastomers were synthesized either as physical polybends or by chemically reacting the elastomers directly onto the polymer backbone. The modified adhesive resins were characterized for thermomechanical properties, fracture toughness and adhesive strength. A second series of elastomer-containing polyimides was also prepared in order to study the effects of the elastomer chain length on polymer properties. Aromatic amine-terminated silicone rubbers with repeat units varying from n = 10 to 105 were reacted onto the polyimide backbone, and the resulting polymers were characterized for their adhesive properties.
In the course of developing improved moisture-resistant epoxy resins, two different types of epoxy resins containing variable mole ratios of chromium ions per polymer repeat unit were developed. Positron annihilation characteristics have been investigated in these resins as a function of their metal ion content. In both cases, the presence of metal ions reduces the lifetime as well as the intensity of the long life component. The long life component intensity reduction is considerably more pronounced than the lifetime reduction. These results have been discussed in terms of increased unpaired electron density at Ps formation sites due to the presence of chromium ions in the matrix.
Thermoplastic polyimide adhesive is used to bond polyimide sheets into flexible laminates. Films are first primed with polyimide adhesive, then bonded together under heat and pressure. Adhesive is cast on separate surface, then sandwiched between polyimide and/or metal films for final assembly. Objectives of process are to improve bonding of high-temperature polyimide film, prepare flexible, large-area, void-free laminates from polyimide film, and laminate polyimide film not only to itself but to metal surfaces.
Aromatic polyamides are processed at relatively low temperature, then heat-treated to attain high softening temperature required when polyamides are used as matrix resins in structural composites. New polyamides are compatable with organic fibers often used as reinforcing agents in such composites Pendent propargyl groups serve as latent cross-linking agents in new series of polyamide resins.
T-Peel strengths of adhesive/Titanium bonds are compared for LARC-13 with and without elastomer additives. Elastomer toughening (incorporation of small amounts of rubber into polymer matrix) has been one of the most successful methods for modifying polymer toughness. Addition polyimides are currently under consideration as high-temperature adhesives for bonding composite materials such as titanium.
Developments in the field of metal-containing polymers are reviewed with emphasis on neutral polymers incorporating dissolved metal salts, metal complexes, organometallic compounds, and metals. Polymer systems discussed include: polyamides, polyimides, polyalcohols, polyesters, polyacetylene, polyethylene, and polysiloxane. Most of the studies focus on the modification of polymer properties such as adhesive properties, thermal behavior, electrical conductivity, polymer flammability, and mechanical properties.