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St. Clair, Anne K.

Publications and source records attributed to St. Clair, Anne K..

At least 19 records

Electrically conductive polyimide film containing gold (III) ions, composition, and process of making

An electrically conductive, thermooxidatively stable poltimide, especially a film thereof, is prepared from an intimate admixture of a particular polyimide and gold (III) ions, in an amount sufficient to provide between 17 and 21 percent by weight of gold (III) ions, based on the weight of electrically conductive, thermooxidatively stable polyimide. The particular polyimide is prepared from a polyamic acid which has been synthesized from a dianhydride/diamine combination selected from the group consisting of 3,3',4,4'-benzophenonetetracarboxylic dianhydride and 2,2-bis[4-(4 -aminophenoxy)phenyl]hexafluoropropane; 3,3',4,4'-benzophenonetetracarboxylic dianhydride and 4,4'-oxydianiline; 2,2'-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride and 4,4'-oxydianiline; and 3,3'4,4'-benzophenonetetracarboxylic dianhydride and 2,2-bis(3-aminophenyl)hexafluoropropane.

Caplan, Maggie L.

Electrically conductive polyimides containing silver trifluoroacetylacetonate

Polyimides with enhanced electrical conductivity are produced by adding a silver ion-containing additive to the polyamic acid resin formed by the condensation of an aromatic dianhydride with an aromatic diamine. After thermal treatment the resulting polyimides had surface conductivities in the range of 1.7.times.10.sup.-3 4.5 .OMEGA..sup.-1 making them useful in low the electronics industry as flexible, electrically conductive polymeric films and coatings.

Rancourt, James D.

Electrically conducting polyimide film containing tin complexes

Disclosed is a thermally-stable SnO.sub.2 -surfaced polyimide film wherein the electrical conductivity of the SnO.sub.2 surface is within the range of about 3.0.times.10.sup.-3 to about 1.times.10.sup.-2 ohms.sup.-1,. Also disclosed is a method of preparing this film from a solution containing a polyamic acid and SnCl.sub.4 (DMSO).sub.2.

St. Clair, Anne K.

Polyimides Made From PDMDA

Thermally stable linear aromatic polyimides with improved optical, electrical, and processing characteristics made from 3,3'-bis(3,4-dicarboxyphenoxy)diphenylmethane dianhydride (PDMDA). Made in form of powders that can be dissolved to cast thin films. Potentially useful as coating and matrix materials. Films made vary from transparent to pale yellow. Greater degrees of transparency and lower dielectric constants make these polyimides more suitable for use in some electronic and optical applications; e.g., as insulating materials on wires and protective films on solar photovoltaic cells.

St. Clair, Anne K.

Polyimides Made From 3,5-Diaminobenzotrifluoride

Polyimides synthesized from 3,5-diaminobenzotrifluoride (DABTF). One monomer of major importance in preparing these high-temperature polymers is 1,3-phenylenediamine (mPDA). Fluorinated polyimides exhibit characteristics potentially attractive for aerospace and electronic applications. Includes optical transparency, solubility in common polar solvents, enhanced thermo-oxidative stability, low dielectric constants, and high glass-transition temperatures. Polyimides also used to form free-standing films, coatings, and moldings.

St. Clair, Terry L.

Aromatic Polyimides With Low Dielectric Constants

Linear aromatic polyimides developed containing dimethylsilane linkages in dianhydride portions of molecules and at least one trifluoromethyl group in each of diamine portions. Polyimides offer advantages of thermal stability, low density, resistance to ionizing radiation, toughness, flexibility, and exhibit lower dielectric constants. Also polyimides nearly transparent and colorless; an advantage in protective coating of solar photovoltaic cells, optical components, and antennas.

St. Clair, Anne K.

Fluorinated Poly(Phenylene Ether Ketones)

Fluorinated poly(phenylene ether ketones) are colorless, transparent, low-dielectric-constant, highly thermally stable polymers. Particularly suitable for use as film and coating materials in electronic and thermal-control applications such as; passivant insulating coats and interlevel dielectrics in microelectronic circuits, or as protective transparent coats on solar cells or mirrors. Solubility and transparency of 12F-PEK along with its lower dielectric constant and other properties make it more useful as dielectric film and coating material in many applications.

St. Clair, Anne K.

Polyimides Containing Silver Trifluoroacetylacetonate

Mechanically strong, flexible, thermally stable, electrically conductive films and coatings suitable for use in electronics industry made by incorporating silver trifluoroacetylacetonate into linear aromatic condensation polyimides. In experimental films, most successful combinations of flexibility and conductivity obtained by use of 1:1, 1:1.74, and 1:2 mole ratios of silver trifluoroacetylacetonate per polyimide repeat unit. Other concentrations of silver trifluoroacetylacetonate used with different heat-treatment schedules to obtain conductive silver-impregnated films.

Stoakley, Diane M.

Electrically Conductive Polyimide Films Containing Gold Surface

Polyimide films exhibiting high thermo-oxidative stability and including electrically conductive surface layers containing gold made by casting process. Many variations of basic process conditions, ingredients, and sequence of operations possible, and not all resulting versions of process yield electrically conductive films. Gold-containing layer formed on film surface during cure. These metallic gold-containing polyimides used in film and coating applications requiring electrical conductivity, high reflectivity, exceptional thermal stability, and/or mechanical integrity. They also find commercial potential in areas ranging from thin films for satellite antennas to decorative coatings and packaging.

Caplan, Maggie L.

Low-Dielectric-Constant Polyimide Fibers

In experiments performed at NASA Langley Research Center, low-dielectric-constant polyimide fibers produced by use of resin extrusion. These fibers also have high thermal stability and good tensile properties. Useful in industrial and aerospace applications in which fibers required to have dielectric constants less than 3, high thermal stability, and tensile properties in range of those of standard textile fibers. Potential applications include use in printed circuit-boards and in aircraft composites.

Dorogy, William E., Jr.

Low-Dielectric-Constant Polyimide/Glass Composites

Advance in polymer technology yields composites having relatively low dielectric constants. Reduction achieved by reducing interactions between linear polyimide chains and by incorporation of fluorine into polymer backbones. Further reductions obtained by physically incorporating selected diamic acid additives into polyimides. Strong potential for use in microelectronics industry for fabrication of printed-circuit boards and fabrication of components for military aircraft.

Stoakley, Diane M.

Metal-Ion Additives Reduce Thermal Expansion Of Polyimides

Polyimides widely used as high-performance polymers because of their excellent thermal stability and toughness. However, their coefficients of thermal expansion (CTE's) greater than those of metals, ceramics, and glasses. Decreasing CTE's of polyimides increase usefulness for aerospace and electronics applications in which dimensional stability required. Additives containing metal ions reduce coefficients of thermal expansion of polyimides. Reductions range from 11 to over 100 percent.

Stoakley, Diane M.

Insoluble, Low-Dielectric-Constant Polyimides

In process, insoluble, low-dielectric-constant polyimides produced by combining dianhydride of bis{4-(3,4-dicarboxyphenoxy) phenyl}perfluoroisopropylidene (BFDA) with fluorinated aromatic diamine; each molecule contains at least one or more CF3 groups. These fully fluorinated polyimides have dielectric constants in range of 2.4 to 2.5 at 10 GHz. Suitable for use as composite matrix resins in advanced aerospace applications. Potential use in microelectronics industry, particularly as insulating resins in production of printed-circuit boards.

St. Clair, Anne K.

Electrically Conductive Polyimide Films

Semiconducting surfaces of SnO2 formed by curing polyamic acids containing tin complexes. Polyimide films made semiconductive via incorporation of semiconductive surface layers of SnO2. If SnO2-surfaced polyimide film used as free-standing film, then semiconductive layer protected by top coat of polyimide, deposited as film from solution directly onto SnO2. Resultant films flexible and resistant to both weather and high temperature. Used on aircraft to provide resistance to lightning strikes, and in microelectronics and flexible circuitry.

St. Clair, Anne K.

Aromatic polyimides containing a dimethylsilane-linked dianhydride

A high-temperature stable, optically transparent, low dielectric aromatic polyimide is prepared by chemically combining equimolar quantities of an aromatic dianhydride reactant and an aromatic diamine reactant, which are selected so that one reactant contains at least one Si(CH.sub.3).sub.2 group in its molecular structure, and the other reactant contains at least one --CH.sub.3 group in its molecular structure. The reactants are chemically combined in a solvent medium to form a solution of a high molecular weight polyamic acid, which is then converted to the corresponding polyimide.

St. Clair, Anne K.

Making Solid Aromatic Polyimide Fibers

Improved wet-spinning process makes aromatic polyamic acid fibers containing no voids, and converts to polyimide fibers also free of voids. Elimination of voids found to improve tensile strength and other tensile properties. Improved polyimide fibers prove useful in protective clothing, sealing materials, filters for harsh chemical and/or thermal environments, and other applications taking advantage of excellent chemical resistance, high thermal stability, and good tensile properties.

St. Clair, Anne K.

Emerging polyheterocyclic films, coatings and resins - Thermoplastic polyquinolines

The processing and performance characteristics of a soluble, thermoplastic polyquinoline suggest its utility in a variety of high performance applications. The polymer is characterized by excellent thermal and oxidative stability, very low moisture absorption, good mechanical properties, very low dielectric constant, and an unusually low thermal expansion coefficient. This polymer, designated PQ-100 (TM), can be cast into strong, transparent, free standing films from common solvents. Coatings of variable thickness can be spin-coated on to silicon and other surfaces. After processing into films, PQ-100 (TM) can be rendered insoluble in a wide range of solvents using a proprietary process. The low CTE contributes to very low residual stress when the polymer is spin-coated onto silicon wafers. PQ-100 (TM) is currently under evaluation for use as an interlayer dielectric substrate in high-density interconnect applications, including multichip modules. Many of the characteristics of the polymer also suggest its utility as a high-performance film and as a matrix resin for specialty composite applications.

Hendricks, Neil H.

Evaluation of optically transparent polyetherimide films for applications in space

Several series of aromatic polyetherimide films have been synthesized and characterized with the objective of obtaining maximum optical transparency for applications in space. Incorporation of phenoxy groups into aromatic polyimides has resulted in a reduction in the color intensity of these films compared to commercial polyimide film by reducing electronic interactions between polymer chains. The resulting lightly colored to colorless polyetherimide films have been characterized by UV-visible and infrared spectroscopy before and after exposure to varying doses of UV and electron irradiation designed to simulate use as second-surface mirror thermal control coatings. After exposure to 300 equivalent solar hours UV irradiation and 1 MeV electron irradiation, the polyetherimides were 2.2 to 2.6 times more transparent than commercial polyimide film of the same thickness.

St. Clair, Anne K.