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St.clair, Terry L.

Publications and source records attributed to St.clair, Terry L..

36 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRS1991

High temperature adhesives

The aerospace and electronics industries have an ever increasing need for higher performance materials. In recent years, linear aromatic polyimides have been proven to be a superior class of materials for various applications in these industries. The use of this class of polymers as adhesives is continuing to increase. Several NASA Langley developed polyimides show considerable promise as adhesives because of their high glass transition temperatures, thermal stability, resistance to solvents/water, and their potential for cost effective manufacture.

St.clair, Terry L.↗
NASA NTRS1991

Processing for maximizing the level of crystallinity in linear aromatic polyimides

The process of the present invention includes first treating a polyamide acid (such as LARC-TPI polyamide acid) in an amide-containing solvent (such as N-methyl pyrrolidone) with an aprotic organic base (such as triethylamine), followed by dehydrating with an organic dehydrating agent (such as acetic anhydride). The level of crystallinity in the linear aromatic polyimide so produced is maximized without any degradation in the molecular weight thereof.

St.clair, Terry L.↗
NASA NTRS1991

A Process for Preparing 1,3-Diamino-5-Pentafluorosulfanylbenzene and Polymers Therefrom

Diamines have shown their utility in the formation of many polymers. Examples of these polymers include polyimides, polyamides, and epoxies. The properties of these polymers are often dependent on the diamine which is used to make the polymer. By the present invention, a process was developed to make a diamine containing pentafluorosulfanylbenzene moiety. This process involves two steps: the preparation of a dinitro precursor and the reduction of the dinitro compound to form the diamine. This diamine was then reacted with various dianhydrides, diacidchlorides, and epoxy resins to yield the corresponding polyimide, polyamide, and epoxy polymers. These polymers were then used to make films, a wire coating enamel, and a semi-permeable membrane. The novelty of this invention resides in the process to make the diamine. Traditionally, dinitro compounds are reduced with hydrazine or a catalyst such as palladium on charcoal. The catalyst which is used in this invention is platinum oxide. When this catalyst is used, it makes it possible to form a polymer-grade diamine.

St.clair, Anne K.↗
NASA NTRS1991

Slow positron beam generator for lifetime studies

A slow positron beam generator uses a conductive source residing between two test films. Moderator pieces are placed next to the test film on the opposite side of the conductive source. A voltage potential is applied between the moderator pieces and the conductive source. Incident energetic positrons: (1) are emitted from the conductive source; (2) are passed through test film; and (3) isotropically strike moderator pieces before diffusing out of the moderator pieces as slow positrons, respectively. The slow positrons diffusing out of moderator pieces are attracted to the conductive source which is held at an appropriate potential below the moderator pieces. The slow positrons have to pass through the test films before reaching the conductive source. A voltage is adjusted so that the potential difference between the moderator pieces and the conductive source forces the positrons to stop in the test films. Measurable annihilation radiation is emitted from the test film when positrons annihilate (combine) with electrons in the test film.

Singh, Jag J.↗
NASA NTRS1991

The development and evaluation of an alternative powder prepregging technique for use with LaRC-TPI/graphite composites

An alternative powder prepregging method for use with LaRC-TPI (a thermoplastic polyimide)/graphite composites is investigated. The alternative method incorporates the idea of moistening the fiber prior to powder coating. Details of the processing parameters are given and discussed. The material was subsequently laminated into small coupons which were evaluated for processing defects using electron microscopy. After the initial evaluation of the material, no major processing defects were encountered but there appeared to be an interfacial adhesion problem. As a result, prepregging efforts were extended to include an additional fiber system, XAS, and a semicrystalline form of the matrix. The semicrystalline form of the matrix was the result of a complex heat treating cycle. Using scanning electron microscopy (SEM), the fiber/matrix adhesion was evaluated in these systems relative to the amorphous/XAS coupons. Based on these results, amorphous and semicrystalline/AS-4 and XAS materials were prepregged and laminated for transverse tensile testing. The results of these tests are presented, and in an effort to obtain more information on the effect of the matrix, remaining semicrystalline transverse tensile coupons were transformed back to the amorphous state and tested. The mechanical properties of the transformed coupons returned to the values observed for the original amorphous coupons, and the interfacial adhesion, as observed by SEM, was better than in any previous sample.

Ogden, Andrea L.↗
NASA NTRS1991

Investigation of microstructural changes in polyetherether-ketone films at cryogenic temperatures by positron lifetime spectroscopy

Microstructural changes in Polyetherether-ketone (PEEK) films were investigated in the temperature ranges of 23 to -196 C, using Positron Lifetime Spectroscopy (PLS) technique. It was determined that the total free volume decreases by about 46 percent in amorphous PEEK samples and about 36 percent in semicrystalline PEEK samples when they are cooled down from room temperature to liquid nitrogen (LN2) temperature. If this trend in reduction in free volume with decreasing temperature continues, as expected, it is surmised that PEEK will be able to withstand cooling down to liquid hydrogen (LH2) temperature without any detrimental effect on its diffusivity for liquid hydrogen.

Singh, Jag J.↗
NASA NTRS1990

The mechanical stability of polyimide films at high pH

Polyimide insulated electrical wire has been widely used in the aerospace industry in commercial, military, and to a lesser degree, general aviation aircraft since the early 1970s. Wiring failures linked to insulation damage have drawn much attention in the media and concerns have developed regarding the long term stability and safety of polyimide insulated electrical wire. The mechanical durability and chemical stability of polyimide insulated wire are affected by hydrolysis, notch propagation, wet and dry arc tracking, topcoat flaking, and degradation due to high pH fluids. Several polyimides were selected for evaluation for resistance to degradation by various aqueous alkaline solutions. The polyimides under evaluation include commercially available films such as KAPTON (tradename), APICAL (tradename), LARC-TPI, and UPILEX (tradename) R and S, as well as a number of experimental films prepared at NASA-Langley. Material properties investigated include viscosity, solubility, moisture absorption, glass transition temperature, dielectric constant, and mechanical properties before and after exposure to various conditions.

Croall, Catharine I.↗
NASA NTRS1990

Processable polyimide adhesive and matrix composite resin

A high temperature polyimide composition prepared by reacting 4,4'-isophthaloyldiphthalic anhydride with metaphenylenediamine is employed to prepare matrix resins, adhesives, films, coatings, moldings, and laminates, especially those showing enhanced flow with retention of mechanical and adhesive properties. It can be used in the aerospace industry, for example, in joining metals to metals or metals to composite structures. One area of application is in the manufacture of lighter and stronger aircraft and spacecraft structures.

Pratt, J. Richard↗
NASA NTRS1990

A study of physical properties of ODPA-p-PDA polyimide films

Physical properties were investigated of ODPA-p-PDA polyimide films, including their lower molecular weight versions with phthalimide endcaps. Free volume, determined by low energy positron annihilation in the test films, was the major parameter of interest since all other physical properties are ostensibly related to it. It affects the dielectric constant as well as the saturation moisture pickup of the test films. An empirical relation was developed between the free volume and molecular weight of the test films, comparable to the Mark-Houwink relation between the polymer solution viscosity and the molecular weight. Development of such a relation constitutes a unique achievement since it enables researchers to estimate the molecular weight of an intractable polymer in solid state for the first time.

Singh, Jag J.↗
NASA NTRS1989

Aromatic polyimides containing a dimethylsilane-linked dianhydride

A high-temperature stable, optically transparent, low dielectric aromatic polyimide is prepared by chemically combining equimolar quantities of an aromatic dianhydride reactant and an aromatic diamine reactant, which are selected so that one reactant contains at least one Si(CH3)2 group in its molecular structure, and the other reactant contains at least one -CF3 group in its molecular structure. The reactants are chemically combined in a solvent medium to form a solution of a high molecular weight polyamic acid, which is then converted to the corresponding polyimide.

St.clair, Anne K.↗
NASA NTRS1989

A slow positron beam generator for lifetime studies

A slow positron beam generator using well-annealed polycrystalline tungsten moderators and a Na-22 positron source was developed. A 250 micro c source, deposited on a 2.54 micron thick aluminized mylar, is sandwiched between two (2.54 cm x 2.54 cm x 0.0127 cm) tungsten pieces. Two (2.54 cm x 2.54 cm x t cm) test polymer films insulate the two tungsten moderator pieces from the aluminized mylar source holder (t=0.00127 to 0.0127). A potential difference of 10 to 100 volts--depending on the test polymer film thickness (t)--is applied between the tungsten pieces and the source foil. Thermalized positrons diffusing out of the moderator pieces are attracted to the source foil held at an appropriate potential below the moderator pieces. These positrons have to pass through the test polymer films before they can reach the source foil. The potential difference between the moderator pieces and the aluminized mylar is so adjusted as to force the positrons to stop in the test polymer films. Thus the new generator becomes an effective source of positrons for assaying thin polymer films for their molecular morphology.

Singh, Jag J.↗
NASA NTRS1989

Polyimide Matrix composites: Polyimidesulfone/LARC-TPI (1:1) blend

Polyimide matrix composites were fabricated from unidirectional unsized AS-4 carbon fiber and a doped 1:1 blend of two polyimides: benzophenone dianhydride-3,3'-diamino diphenylsulfone (PISO2) and benzophenone dianhydride-3,3'-diamino benzophenone (LARC-TPI). To enhance melt flow properties, the molecular weight of the PISO2 was controlled by end-capping with phthalic anhydride and addition of 5 percent by weight p-phenylene diamine-phthalic anhydride bisamic acid dopant. Prepreg was drum-wound using a diglyme slurry comprised of the soluble polyamideacid of PISO2, the soluble bisamideacid of the dopant, and the insoluble imidized LARC-TPI powder. Melt flow studies with a rotary rheometer and parallel plate plastometer on neat resin and prepreg helped develop an optimum cure cycle. Composite mechanical properties at room and elevated temperatures, dry and moisture-saturated, were evaluated, including short beam shear strength and flexure, tensile, shear, and compression properties. Two 18 in. x 24 in. skin-stringer panels were fabricated, one of which was tested in compression to failure.

Johnston, Norman J.↗
NASA NTRS1988

A study of thermal transitions in a new semicrystalline thermoplastic polyimide

A polyimide derive from 4,4'-isophthaloyl diphthalic anhydride (IDPA) and 1,3-bis (4-aminophenoxy 4'-benzoyl) benzene (1,3-BABB) having semicrystalline behavior was prepared and characterized by differential scanning calorimetry (DSC) and wide angle X-ray scattering (WAXS). Thus a poly(amic acid) film cured in air for one hour each at 100 and 200 C displayed an endotherm at 286 C, followed by a crystallization exotherm at 317 C, and a second melting transition at 350 C. The 286 C melting point appeared to result from earlier solvent-induced crystallization. Films cast from DMAc, air dried, and soaked in methylene chloride could not be induced into semicrystallinity. The fully cured polyimide has a Tg of 216 C. Films heated to temperatures as high as 100 C for one hour in air were transparent and light yellow in color. Those films heated to or above 125 C were translucent. Polarized light microscopy revealed the presence of spherulites 608 micrometers in diameter in a sample cured to 275 C in air. Two film samples, one cured to 275 and the other to 325 C, were evaluated for tensile and ultimate strength, modulus, and percent elongation at 25 and 200 C. These values remained essentially constant at each test temperature.

Pratt, J. Richard↗
NASA NTRS1988

Flexible backbone aromatic polyimide adhesives

Continuing research at Langley Research Center on the synthesis and development of new inexpensive flexible aromatic polyimides as adhesives has resulted in a material identified as LARC-F-SO2 with similarities to polyimidesulfone, PISO2, and other flexible backbone polyimides recently reported by Progar and St. Clair. Also prepared and evaluated was an endcapped version of PISO2. These two polymers were compared with LARC-TPI and LARC-STPI, polyimides research in our laboratory and reported in the literature. The adhesive evaluation, primarily based on lap shear strength (LSS) tests at RT, 177 C and 204 C, involved preparing adhesive tapes, conducting bonding studies and exposing lap shear specimens to 204 C air for up to 1000 hrs and to a 72-hour water boil. The type of adhesive failure as well as the Tg was determined for the fractured specimens. The results indicate that LARC-TPI provides the highest LSSs. LARC-F-SO2, LARC-TPI and LARC-STPI all retain their strengths after thermal exposure for 1000 hrs and PISO2 retains greater than 80 percent of its control strengths. After a 72-hr water boil exposure, most of the four adhesive systems showed reduced strengths for all test temperatures although still retaining a high percentage of their original strength (greater than 60 percent) except for one case. The predominant failure type was cohesive with no significant change in the Tgs.

Progar, Donald J.↗
NASA NTRS1988

Flexibilized copolyimide adhesives

Two copolyimides, LARC-STPI and STPI-LARC-2, with flexible backbones were processed and characterized as adhesives. The processability and adhesive properties were compared to those of a commercially available form of LARC-TPI. Lap shear specimens were fabricated using adhesive tape prepared from each of the three polymers. Lap shear tests were performed at room temperature, 177 C, and 204 C before and after exposure to water-boil and to thermal aging at 204 C for up to 1000 hours. The three adhesive systems possess exceptional lap shear strengths at room temperature and elevated temperatures both before and after thermal exposure. LARC-STPI, because of its high glass transition temperature provided high lap shear strengths up to 260 C. After water-boil, LARC-TPI exhibited the highest lap shear strengths at room temperature and 177 C, whereas the LARC-STPI retained a higher percentage of its original strength when tested at 204 C. These flexible thermoplastic copolyimides show considerable potential as adhesives based on this study and because of the ease of preparation with low cost, commercially available materials.

Progar, Donald J.↗
NASA NTRS1987

Soluble aromatic polyimides for film and coating applications

Linear all-aromatic polyimides have been synthesized and characterized which show much potential as films and coatings for electronic applications. Structure-property relations with regard to methods for obtaining solubility of fully imidized polymers will be discussed. Methods used to obtain solubility include variation of polymer molecular structure, variation of isomerism of the diamine monomer, modification of cure time/temperature and atmosphere. Other properties of soluble polyimides will be presented which include glass transition temperatures, thermooxidative stabilities, UV-visible spectra, and refractive indices.

St.clair, Anne K.↗
NASA NTRS1986

Soluble aromatic polyimides for film and coating applications

Linear all-aromatic polyimides have been synthesized and characterized which show much potential as films and coatings for electronic applications. Structure-property relations with regard to methods for obtaining solubility of fully imidized polymers will be discussed. Methods used to obtain solubility include variation of polymer molecular structure, variation of isomerism of the diamine monomer, modification of cure time/temperature and atmosphere. Other properties of soluble polyimides will be presented which include glass transition temperatures, thermooxidative stabilities, UV-visible spectra, and refractive indices.

St.clair, Anne K.↗