Stancu, Constantin C.

DOE OSTI2021

Power inverter module with reduced inductance

A power inverter module includes a base module having a plurality of electrically conductive layers, including a first conductive layer, a second conductive layer and a third conductive layer. A first terminal is operatively connected to the first conductive layer at a first end and a second terminal is operatively connected to the second conductive layer at the first end. An isolation sheet is sandwiched between the first and second terminals. The first terminal and the second terminal include a respective proximal portion composed of a first material and a respective distal portion composed of a second material. At least one of the first terminal and the second terminal is bent to create an overlap zone such that a gap between the first terminal and the second terminal in the overlap zone is less than a threshold distance. The power inverter module is configured to reduce parasitic inductance.

Jaksic, Marko↗

DOE OSTI2020

High-frequency direct current bulk capacitors with interleaved busbar packages

Presented are electrical capacitors with interleaved busbar architectures, methods for making/operating such capacitors, and electric-drive vehicles equipped with such capacitors. A bulk capacitor includes multiple capacitor devices disposed within an outer housing and operable to modify electric current transmitted between a power source and an electrical load. An interleaved busbar package is interposed between the capacitor devices and outer housing. The interleaved busbar package includes a first busbar plate that electrically connects to first terminals of the capacitor devices and defines a busbar pocket. A second busbar plate is seated within the busbar pocket and electrically connects to second terminals of the capacitor devices. The second busbar plate includes a capacitor basin that seats therein the capacitor devices. An isolator sheet is interleaved between and electrically insulates the first and second busbar plates. The capacitor devices and interleaved busbar package may be partially submerged in an epoxy endfill composition.

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