Engineering topics

Sunada, Eric T.

Publications and source records attributed to Sunada, Eric T..

9 records

NASA NTRS2013

Micro-Textured Black Silicon Wick for Silicon Heat Pipe Array

Planar, semiconductor heat arrays have been previously proposed and developed; however, this design makes use of a novel, microscale black silicon wick structure that provides increased capillary pumping pressure of the internal working fluid, resulting in increased effective thermal conductivity of the device, and also enables operation of the device in any orientation with respect to the gravity vector. In a heat pipe, the efficiency of thermal transfer from the case to the working fluid is directly proportional to the surface area of the wick in contact with the fluid. Also, the primary failure mechanism for heat pipes operating within the temperature range of interest is inadequate capillary pressure for the return of fluid from the condenser to the wick. This is also what makes the operation of heat pipes orientation-sensitive. Thus, the two primary requirements for a good wick design are a large surface area and high capillary pressure. Surface area can be maximized through nanomachined surface roughening. Capillary pressure is largely driven by the working fluid and wick structure. The proposed nanostructure wick has characteristic dimensions on the order of tens of microns, which promotes menisci of very small radii. This results in the possibility of enormous pumping potential due to the inverse proportionality with radius. Wetting, which also enhances capillary pumping, can be maximized through growth of an oxide layer or material deposition (e.g. TiO2) to create a superhydrophilic surface.

Yee, Karl Y.↗

NASA NTRS2013

Silicon Heat Pipe Array

Improved methods of heat dissipation are required for modern, high-power density electronic systems. As increased functionality is progressively compacted into decreasing volumes, this need will be exacerbated. High-performance chip power is predicted to increase monotonically and rapidly with time. Systems utilizing these chips are currently reliant upon decades of old cooling technology. Heat pipes offer a solution to this problem. Heat pipes are passive, self-contained, two-phase heat dissipation devices. Heat conducted into the device through a wick structure converts the working fluid into a vapor, which then releases the heat via condensation after being transported away from the heat source. Heat pipes have high thermal conductivities, are inexpensive, and have been utilized in previous space missions. However, the cylindrical geometry of commercial heat pipes is a poor fit to the planar geometries of microelectronic assemblies, the copper that commercial heat pipes are typically constructed of is a poor CTE (coefficient of thermal expansion) match to the semiconductor die utilized in these assemblies, and the functionality and reliability of heat pipes in general is strongly dependent on the orientation of the assembly with respect to the gravity vector. What is needed is a planar, semiconductor-based heat pipe array that can be used for cooling of generic MCM (multichip module) assemblies that can also function in all orientations. Such a structure would not only have applications in the cooling of space electronics, but would have commercial applications as well (e.g. cooling of microprocessors and high-power laser diodes). This technology is an improvement over existing heat pipe designs due to the finer porosity of the wick, which enhances capillary pumping pressure, resulting in greater effective thermal conductivity and performance in any orientation with respect to the gravity vector. In addition, it is constructed of silicon, and thus is better suited for the cooling of semiconductor devices.

Yee, Karl Y.↗

NASA NTRS2011

Qualifications of Bonding Process of Temperature Sensors to Deep-Space Missions

A process has been examined for bonding a platinum resistance thermometer (PRT) onto potential aerospace materials such as flat aluminum surfaces and a flexible copper tube to simulate coaxial cables for flight applications. Primarily, PRTs were inserted into a silver-plated copper braid to avoid stresses on the sensor while the sensor was attached with the braid to the base material for long-duration, deep-space missions. A1-1145/graphite composite (planar substrate) and copper tube have been used in this study to assess the reliability of PRT bonding materials. A flexible copper tube was chosen to simulate the coaxial cable to attach PRTs. The substrate materials were cleaned with acetone wipes to remove oils and contaminants. Later, the surface was also cleaned with ethyl alcohol and was air-dried. The materials were gently abraded and then were cleaned again the same way as previously mentioned. Initially, shielded (silver plated copper braid) PRT (type X) test articles were fabricated and cleaned. The base antenna material was pretreated and shielded, and CV-2566 NuSil silicone was used to attach the shielded PRT to the base material. The test articles were cured at room temperature and humidity for seven days. The resistance of the PRTs was continuously monitored during the thermal cycling, and the test articles were inspected prior to, at various intermediate steps during, and at the end of the thermal cycling as well. All of the PRTs survived three times the expected mission life for the JUNO project. No adhesion problems were observed in the PRT sensor area, or under the shielded PRT. Furthermore, the PRT resistance accurately tracked the thermal cycling of the chamber.

Ramesham, Rajeshuni↗

NASA NTRS2011

Fluid Line Evacuation and Freezing Experiments for Digital Radiator Concept

The digital radiator technology is one of three variable heat rejection technologies being investigated for future human-rated NASA missions. The digital radiator concept is based on a mechanically pumped fluid loop with parallel tubes carrying coolant to reject heat from the radiator surface. A series of valves actuate to start and stop fluid flow to di erent combinations of tubes, in order to vary the heat rejection capability of the radiator by a factor of 10 or more. When the flow in a particular leg is stopped, the fluid temperature drops and the fluid can freeze, causing damage or preventing flow from restarting. For this reason, the liquid in a stopped leg must be partially or fully evacuated upon shutdown. One of the challenges facing fluid evacuation from closed tubes arises from the vapor generated during pumping to low pressure, which can cause pump cavitation and incomplete evacuation. Here we present a series of laboratory experiments demonstrating fluid evacuation techniques to overcome these challenges by applying heat and pumping to partial vacuum. Also presented are results from qualitative testing of the freezing characteristics of several different candidate fluids, which demonstrate significant di erences in freezing properties, and give insight to the evacuation process.

human space flight↗

NASA NTRS2011

Design and Modeling of a Variable Heat Rejection Radiator

Variable Heat Rejection Radiator technology needed for future NASA human rated & robotic missions Primary objective is to enable a single loop architecture for human-rated missions (1) Radiators are typically sized for maximum heat load in the warmest continuous environment resulting in a large panel area (2) Large radiator area results in fluid being susceptible to freezing at low load in cold environment and typically results in a two-loop system (3) Dual loop architecture is approximately 18% heavier than single loop architecture (based on Orion thermal control system mass) (4) Single loop architecture requires adaptability to varying environments and heat loads

fluid flow↗

NASA NTRS2011

Qualification of Bonding Process of Temperature Sensors to Extreme Temperature Deep Space Missions

A process has been explored based on the state-of-the-art technology to bond the platinum resistance thermometer (PRT) on to potential aerospace material such as a flat aluminum surface and a flexible copper tube to simulate coaxial cable for the flight applications. Primarily, PRTs were inserted into a metal plated copper braid to avoid stresses on the sensor while attaching the sensor with braid to the base material for long duration deep space missions. Appropriate pretreatment has been implemented in this study to enhance the adhesion of the PRTs to the base material. NuSil product has been chosen in this research to attach PRT to the base materials. The resistance (approx.1.1 k(Omega)) of PRTs has been electrically monitored continuously during the qualification thermal cycling testing from -150 C to +120 C and -100 C to -35 C. The test hardware has been thermal cycled three times the mission life per JPL design principles for JUNO project. No PRT failures were observed during and after the PRT thermal cycling qualification test for extreme temperature environments. However, there were some failures associated with staking of the PRT pig tails as a result of thermal cycling qualification test.

Extreme temperatures↗

NASA NTRS2005

Mars Exploration Rover Entry, Descent, and Landing: A Thermal Perspective

Perhaps the most challenging mission phase for the Mars Exploration Rovers was the Entry, Descent, and Landing (EDL). During this phase, the entry vehicle attached to its cruise stage was transformed into a stowed tetrahedral Lander that was surrounded by inflated airbags through a series of complex events. There was only one opportunity to successfully execute an automated command sequence without any possible ground intervention. The success of EDL was reliant upon the system thermal design: 1) to thermally condition EDL hardware from cruise storage temperatures to operating temperature ranges; 2) to maintain the Rover electronics within operating temperature ranges without the benefit of the cruise single phase cooling loop, which had been evacuated in preparation for EDL; and 3) to maintain the cruise stage propulsion components for the critical turn to entry attitude. Since the EDL architecture was inherited from Mars Pathfinder (MPF), the initial EDL thermal design would be inherited from MPF. However, hardware and implementation differences from MPF ultimately changed the MPF inheritance approach for the EDL thermal design. With the lack of full inheritance, the verification and validation of the EDL thermal design took on increased significance. This paper will summarize the verification and validation approach for the EDL thermal design along with applicable system level thermal testing results as well as appropriate thermal analyses. In addition, the lessons learned during the system-level testing will be discussed. Finally, the in-flight EDL experiences of both MER-A and -B missions (Spirit and Opportunity, respectively) will be presented, demonstrated how lessons learned from Spirit were applied to Opportunity.

thermal↗

NASA NTRS2005

Mars Exploration Rover surface mission flight thermal performance

NASA launched two rovers in June and July of 2003 as a part of the Mars Exploration Rover (MER) project. MER-A (Spirit) landed on Mars in Gusev Crater at 15 degrees South latitude and 175 degree East longitude on January 4, 2004 (Squyres, et al., Dec. 2004)). MER-B (Opportunity) landed on Mars in Terra Meridiani at 2 degrees South latitude and 354 degrees East longitude on January 25, 2004 (Squyres, et al., August 2004) Both rovers have well exceeded their design lifetime (90 Sols) by more than a factor of 4. Spirit and Opportunity are still healthy and continue to execute their roving science missions at the time of this writing. This paper discusses rover flight thermal performance during the surface missions of both vehicles, covering roughly the time from the MER-A landing in late Southern Summer (Ls = 328, Sol 1A) through the Southern Winter solstice (Ls = 90, Sol 255A) to nearly Southern Vernal equinox (Ls = 160 , Sol 398A).

thermal design↗

NASA NTRS2004

Thermal Design and Flight Experience of the Mars Exploration Rover Spacecraft Computer-Controlled, Propulsion Line Heaters

This paper covers the design, thermal testing and flight experiences with the computer-controlled thermostats on the propulsion line heaters. Flight experience revealed heater control behavior with propellant loaded into the system and during thruster firings that was not observable during system level testing. Explanations of flight behavior, lessons learned, and suggestions for improvement of the propellant line heater design are presented in this paper.

propulsion lines↗