Soiling, cleaning, and abrasion: The results of the 5-year photovoltaic glass coating field study
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Engineering topics
Publications and source records attributed to Tamizhmani, Govindasamy.
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When photovoltaic (PV) modules are installed on rooftops, the module temperature depends primarily on the geographic location and the mounting configuration. If the mounting structure does not provide sufficient airflow in a hot environment, the 98th percentile temperature will exceed 70°C, which according to IEC TS 63126 ED. 1, requires higher levels of thermal stability testing. However, there is no clear way to determine the temperature level needed for a particular location and system design. Here, in this work, we identify a relationship between the module standoff to the rooftop and the module temperature and propose methods to describe a minimum standoff for typical PV modules in a simple mounting configuration installed in a given location. For more complex system designs, we show how to determine an equivalent “effective standoff” that can be applied to generic calculations. Lastly, we show measurements and calculations from several systems to demonstrate how this method could work.
External contamination ("soiling") of the incident surface is a major limiting factor for solar technologies. A 5-year field glass coupon study was conducted to better understand external contamination and its effects; compare cleaning methods and the use of preventative coatings; and explore the abrasion resulting from cleaning to advise on accelerated abrasion testing. Test sites included the cities of Dubai (UAE), Kuwait City (Kuwait), Mesa (AZ), Mumbai (India), and Sacramento (CA). Through the 5-year cumulative study, dry brush, water spray, and wet sponge and squeegee cleaning methods were compared to no cleaning. Optical microscopy was used to obtain images, including representative color images, grayscale images for object analysis, and oblique images for coating integrity assessment. A thresholding protocol was developed to analyze and distinguish specimens using the ImageJ software. Optical performance was quantified using a spectrophotometer, including comprehensive optical characterization (transmittance, reflectance, and absorptance in addition to forward- and back-scattering). Atomic force microscopy was used to verify the abrasion damage morphology, including the width and depth of surface scratches. Analysis of the results included correlation of optical performance and particle area coverage, rank order (by coating or location), and the acceleration factor for abrasion damage. The efficacy of external cleaning was more readily distinguished from the effectiveness of antisoiling coatings. The acceleration factor for dry brush cleaning of a porous silica coating was found to be on the order of unity.
Leakage currents measured on PV modules in the field originate from a potential difference between the modules' frame and the cells. They can be a relative indicator of Potential-Induced Degradation (PID) severity, especially when comparing the same module design in a different environment. As modules are not operating at night, no leakage current should be observed but our team has reported several events of nighttime leakage currents on bifacial PV modules. These events have been firstly observed during a thunderstorm that are characterized by strong atmospheric electrical field values. This lead us to believe that nighttime leakage currents could originate from the atmospheric electric charges. In this paper, we correlate nighttime leakage currents measured on bifacial PV modules with field mill data to identify the origin of nighttime leakage currents. Our results show that so far, no leakage currents at night occur when the atmospheric electric field is between 0 and 150–200 V/m (standard value for fair weather). As soon as the atmospheric electric field is out of this range, leakage currents are observed with or without rain involved. This suggests a transport of charged particles from the atmosphere to the modules' frame. A combination of heavy rain with strong atmospheric electric field results into high nighttime leakage currents with a magnitude up to 8 times higher than what observed during the day with -1500V applied. This is explained by an easier transport of the charged particles through the water droplets. Based on these results, leakage currents observed during the day might not be only due to the inherent potential difference between the frame and the cells depending on the atmospheric electric field activity. We believe that it should be taken into account in PID studies.
We demonstrate a charges transfer from the atmosphere to the modules’ frame in the field and discuss the mechanism - leakage current measured in the field are not only related to the PV module operation - this is crucial to consider in potential-induced degradation modeling
When photovoltaic modules are installed on rooftops the temperature is dependent on both the geographic location and the mounting configuration. If the mounting structure does not provide sufficient air flow in a hot environment, the 98th percential temperature will exceed 70 degrees C which according to IEC TS 63126 requires higher levels of thermal stability testing. However, a simple there is not a clear way to determe which temperature level is needed for a particular location and system design. In this work we identify a relationship between the gap between the rooftop and a module and propose methods to describe minimum gaps for a given location. Because system designs vary in more ways than just the gap, we show how to determine an effective gap which can be simply applied to generic calculations. Lastly, we show measurements and calculations from several systems to demonstrate how this method could work.
Bifacial modules are increasingly deployed in the field and are expected to represent half of the market share within 10 years. Their rear structure differs from monofacial modules to allow additional light absorption. However, it brings new reliability challenges to address. In particular, the risk of potential-induced degradation (PID) is increased as both module sides are impacted. Different PID processes have been identified in the literature: shunting type (PID-s), polarization type (PID-p), Na penetration type, and corrosion type (PID-c). Their occurrence depends on the photovoltaic system configuration as well as the module's materials. Apart from PID-s, PID processes are not well understood and extensive research is needed to elucidate the PID scenario and underlying mechanisms. Herein, current knowledge about PID processes and their impact on the main bifacial modules in the market are gathered with the aim to guide future research. Bifacial module technologies and leakage current paths leading to PID are described. Indoor and outdoor PID testing methods are detailed. For each bifacial module technology, the PID processes are investigated with their indicators, mechanism and recovery process. Furthermore, PID-impacting factors and limitation solutions are finally reported and a state of the art on PID modeling is presented.
This paper investigates the effect of hotspot (HS) stress endurance of two of the latest designs of monocrystalline modules: a half-cell glass/backsheet (G/B) module and a full-cell glass/glass (G/G) module. These modules have already been pre-stressed in extended thermal cycling with 600 cycles per the IEC 61215 standard to represent field-stressed modules. This study differs from the other conventional studies wherein only fresh modules are subjected to hotspot endurance stress. The G/G module reached a maximum temperature of approximately 200 °C at a cell shading of 25 %, 55 °C higher than the maximum hotspot temperature of 145 °C in the G/B module. A significant burn mark, without glass shattering, was observed in the hotspot-stressed cell of the G/G module due to the current mismatch induced by partial shading. Most of the cells in the G/G module appear to be severely damaged (severe dark areas), as observed in the electroluminescence (EL) image, while the dark regions were rarely present in the G/B module. The EL image also illustrates multiple cell cracks that resist current flow and eventually contribute to the full-cell module degradation. About 8.3 % degradation in maximum power was observed for the G/G module and 1.3 % for the G/B module after the sequential stress tests. The lower degradation in the G/B module can potentially be attributed to its design, which comprises of two parallel strings, each having 72-half-cells and benefits from lower heat dissipation. Furthermore, this indicates that the half-cell design could potentially minimize the hotspot degradation and failures in crystalline-silicon modules.
In view of the increasing interest and market share of bifacial cells and modules, suitable substrates such as glass and transparent backsheets along with ethylene vinyl acetate (EVA) and polyolefin elastomer (POE) encapsulants were examined in combined-accelerated stress testing (C-AST) to evaluate and compare degradation modes. Testing with both monofacial and bifacial cells, we found glass-glass modules with monofacial cells led to greater grid finger breakage than those with polymeric backsheets. Furthermore, this is attributed to previous X-ray topography and modeling work showing higher stress in cells and interconnections in glass-glass modules than glass-backsheet modules. Consistent with the objectives of C-AST, which stresses modules at levels corresponding to the limits seen in the natural environment, we observed the UV-fluorescence signatures of modules tested in C-AST (considering the degradation associated with developing chromophores, moisture penetration and photobleaching effects) to be like those in fielded modules, more so than other chamber stress testing implemented for comparison. We found light-induced degradation (LID) in module types with regenerated (inactive) cells with C-AST, suggesting the possibility of LID destabilization in some field conditions. We could also distinguish potential-induced degradation (PID) on the back of the bifacial passivated emitter and rear cells (PERC) in C-AST. Confirming with ex-situ tests, we found polarization-type PID most prevalent in glass-glass modules with EVA as would be anticipated considering the greater leakage current through such module encapsulation. Unlike PID tests performed in the dark, which can lead to false positive PID test results, field-representative illumination is experienced by the modules on the front and back side while –1200 V system voltage is applied in C-AST, supporting the conclusion that this module type with glass-glass construction would be susceptible to PID in the field.
The reliability, durability and lifetime performance of passivated emitter, rear cell (PERC) modules used in real-world PV power plants is a critical challenge underlying the rapid adoption and bankability of these PERC cells, whose high efficiency help reduce the levelized cost of electricity (LCOE). We propose a degradation-science study of PERC module degradation pathways, benchmarking them relative to known degradation mechanisms and pathways of the incumbent aluminum back surface field (Al-BSF) modules exposed to real-world and accelerated exposure conditions.
The longevity of solar photovoltaic modules depends on the durability and reliability of their components, one of which is the solder bonds in interconnect ribbons. The solder joints experience stresses from thermal cycling and constant elevated temperatures (40 °C-70 °C) in regular field operation leading to thermo-mechanical fatigue and intermetallic compound formation. To study the end-of-life wear-out mechanisms and to obtain activation energy of solder bond degradation, here two field-aged modules from Arizona-a 21-year-old Solarex MSX60 module (with Sn62Pb36Ag2 at the solder joints) and an 18-year-old Siemens M55 module (with Sn60Pb40 at the solder joints)-underwent 800 and 400 modified thermal cycles, respectively. Using three heating blankets, each module had three temperature zones maintained at 85, 95, and 105 °C during the 15-min hot dwell time of the thermal cycle. Cell-level series resistance data obtained from three temperature zones enabled the calculation of activation energy for solder bond degradation for the MSX60 and the M55 modules to be 0.12 eV and 0.35 eV, respectively. From each temperature zone in both modules, busbar-solder samples were obtained, imaged through SEM, and analyzed with energy-dispersive X-ray spectroscopy. In the MSX60 module with traces of Ag in the solder material, phase segregation and growth were primarily observed at high temperatures. For M55 modules without Ag in the solder material, major phase segregation was observed in all temperature zones. The IMC thickness for both modules increased with increasing module temperature. The beneficial effect of Ag in solder material on mitigating solder bond degradation is presented.
A system for evaluation of soiling of solar photovoltaic (PV) modules may comprise a first pair of solar PV modules exposed to the elements, a second pair of solar PV modules enclosed within a protective housing having a glass cover; a component coupling the glass cover to the protective housing. The component may be configured to displace the glass cover for a limited period of time to temporarily expose the second pair of solar PV modules to the atmospheric elements.
This paper presents a preliminary reliability analysis of field-aged glass/glass (G/G) PV modules. Several characterization tests were performed on more than 60 modules with two different encapsulant types (EVA and ionomer) exposed in hot-dry Arizona (AZ) climate over 10-35 years. The common degradation mode observed in both encapsulant types was the delamination of encapsulant along with encapsulant browning (EVA only), glass cracking (EVA only), and metallic corrosion over junction box area (ionomer only). The EVA encapsulated G/G modules showed the higher median power degradation rate at 0.91-1.99%/yr whereas modules with ionomer showed the lower at 0.21%/yr.
Accurate modeling of photovoltaic (PV) performance requires the precise calculation of module temperature. Currently, most temperature models rely on steady-state assumptions that do not account for the transient climatic conditions and thermal mass of the module. On the other hand, complex physics-based transient models are computationally expensive and difficult to parameterize. In order to address this, a new approach to transient thermal modeling was developed, in which the steady-state predictions from previous timesteps are weighted and averaged to accurately predict the module temperature at finer time scales. This model is informed by 3-D finite-element analyses, which are used to calculate the effect of wind speed and module unit mass on module temperature. The model, in application, serves as an added filter over existing steady-state models that smooths out erroneous values that are a result of intermittency in solar resource. Validation of this moving-average model has shown that it can improve the overall PV energy performance model accuracy by as much as 0.58% over steady-state models based on mean absolute error improvements and can significantly reduce the variability between the model predictions and measured temperature times series data.
The reliability of solder joints in the solar cell metallization-interconnect system influences the lifetime of photovoltaic modules. Two field-aged modules-one with Sn 62 Pb 36 Ag 2 solder at the solder joints (Solarex MSX 60), and the other with the standard Sn 60 Pb 40 solder (Siemens M55)-were subjected to a modified thermal cycling (TC) test of IEC 61215. Three sections in each module were maintained at 85 degrees C, 95 degrees C, and 105 degrees C during the 15-minute high temperature dwell time. Current equivalent to the module short-circuit current was injected through the module when the chamber temperature was above 25 degrees C to simulate regular field operation. This novel approach aims to induce thermomechanical fatigue (TMF) at the solder joints and intermetallic compound (IMC) formation at the metal/solder interfaces. The activation energy (E a ) for solder bond degradation was calculated based on the series resistance (R s ) increase in TC testing rather than power drop to avoid the effect of confounding variables. Module-level R s increase in MSX 60 module after TC800 cycles and in M55 module after TC400 cycles was 1.22% and 183.7%, respectively. The E a determined for the module with 2wt% Ag is 0.24 eV and for that with the standard solder is 0.27 eV. The solder bond degradation seems to have been driven by TMF rather than IMC formation for both modules.