SENSITIVITY OF COPPER DISSOLUTION TO THE FLOW BEHAVIOR OF MOLTEN SN-PB SOLDER.
Abstract not provided.
Vianco, Paul T↗
Engineering topics
Vianco, Paul T
Publications and source records attributed to Vianco, Paul T.
Challenges Facing the High Temperature Electronics Industry in the Event of Restrictions on High-Pb Solders.
Abstract not provided.
Vianco, Paul T↗
Controlling braze joint gap uniformity for exceptional tensile strengths.
Abstract not provided.
Walker, Charles A.↗
Run-out Phenomenon in Ag-Cu-Zr Active Braze Joints Made Between Alumina and an Fe-Ni-Co Alloy.
Abstract not provided.
Vianco, Paul T↗
Simulating Solder Fatigue Crack Initiation and Growth in a Surface Mount Package.
Abstract not provided.
Neilsen, Michael K.↗
Predicting the Reliability Of Package-on-Package Interconnections Using Computational Modeling.
Abstract not provided.
Vianco, Paul T↗
PREDICTING THE RELIABILITY OF PACKAGE-ON-PACKAGE INTERCONNECTIONS USING COMPUTATIONAL MODELING SOFTWARE.
Abstract not provided.
Vianco, Paul T↗
Unified Creep Plasticity Damage (UCPD) Model for SAC396 Solder.
Abstract not provided.
Neilsen, Michael K.↗
A Pin Pull Test A Pin Pull Test to Assess the Adhesion of Thin Film Conductors on LTCC Substrates.
Abstract not provided.
Vianco, Paul T↗
use of TurboSiP Software to Predict the Long-Term Reliaility of Solder Joints on Photovoltaic Systems.
Abstract not provided.
Sorensen, Neil R↗
Use of the TurboSiP(C) Software to Predict the Long-Term Reliability of Solder Joints on Photovoltaic Systems.
Abstract not provided.
Sorensen, Neil R↗
Monolithic exploding foil initiator
A monolithic exploding foil initiator (EFI) or slapper detonator and the method for making the monolithic EFI wherein the exploding bridge and the dielectric from which the flyer will be generated are integrated directly onto the header. In some embodiments, the barrel is directly integrated directly onto the header.
47 OTHER INSTRUMENTATION↗