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Vilem Mikula

Publications and source records attributed to Vilem Mikula.

Superfluid-Tight Cryogenic Receiver With Continuous Sub-Kelvin Cooling for EXCLAIM

The EXperiment for Cryogenic Large-Aperture Intensity Mapping (EXCLAIM) is a balloon-borne telescope designed to survey star formation over cosmological time scales using intensity mapping in the 420 – 540 GHz frequency range. EXCLAIM uses a fully cryogenic telescope coupled to six on-chip spectrometers featuring kinetic inductance detectors (KIDs) to achieve high sensitivity, allowing for fast integration in dark atmospheric windows. The telescope receiver is cooled to ≈ 1.7 K by immersion in a superfluid helium bath and enclosed in a superfluid-tight shell with a meta-material anti-reflection coated silicon window. In addition to the optics and the spectrometer package, the receiver contains the magnetic shielding, the cryogenic segment of the spectrometer readout, and the sub-Kelvin cooling system. A three-stage continuous adiabatic demagnetization refrigerator (CADR) keeps the detectors at 100 mK while a 4He sorption cooler provides a 900 mK thermal intercept for mechanical suspensions and coaxial cables. We present the design of the EXCLAIM receiver and report on the flight-like testing of major receiver components, including the superfluid-tight receiver window and the sub-Kelvin coolers.

continuous adiabatic demagnetization refrigerator↗

Uncooled Doped-Si Thermopiles for Thermal Land Imaging Applications

Sustained and enhanced land imaging is crucial for providing high-quality science data on change in land use, forest health, environment, and climate. Future thermal land imaging instruments operating in the 10-12 micron band will provide essential information for furthering our hydrologic understanding at scales of human influence, and producing field-scale moisture information through accurate retrievals of evapotranspiration (ET). To address the need for cost-effective future thermal land imaging missions we are developing novel uncooled doped-silicon thermopile detectors, an extension of a detector design concept originally developed at NASA-Goddard for planetary science applications. These doped-Si thermopile detectors have the potential to offer superior performance in terms of sensitivity, speed, and customization, when compared to current commercial-off-the-shelf uncooled detector technologies. Because cryocooler technology does not need to be fielded on the instrument, these and other uncooled detectors offer the benefit of greatly reduced instrument cost, mass, and power at the expense of some acceptable loss in detector sensitivity. We present the motivation for an uncooled thermal imaging instrument, our doped-Si thermopile detector concept, and performance expectations and comparisons. We also provide an update on the current status of this detector technology development.

Thermopiles↗

Microcalorimeter Absorber Optimization for 0.2 to 12 keV X-Rays

The Advanced Telescope for High ENergy Astrophysics (ATHENA) mission requires high quantum efficiency (QE) x-ray absorption, >90.6% at 7 keV and low specific heat capacity, 0.731 pJ/K. The designed ATHENA x-ray absorbers are cantilevered square tiles (pitch of 317 microns) of 1.05 μm thick Au and 5.51 μm thick Bi electroplated films supported by stems that connect the absorber to the detector below. We discuss some of the methods used to produce x-ray absorbers meeting these specifications for ATHENA. To tune the thermal conductance of the device and the effect on the normal-to superconducting transition shape, the stems need to be small diameter and can have a weak bottle-neck connection to the substrate. A funnel shape of the stem using a proximity exposed photoresist mold has been developed to improve the strength of the connections. Further requirements on the absorbers include low levels of fine particulate remaining on the substrate after production and zero shorts between absorbers due to incomplete ion milling or trapped fine particular between absorbers. To optimize for post patterning substrate cleanliness and absorber yield, we have examined several methods of absorber fabrication. Three such methods are 1) an ion mill/wet etch combination, 2) a photoresist mold for electroplating followed by wet or dry etch to remove the seed layer, and 3) an electroplating process with leveling to smooth the surface followed by ion mill to separate the absorbers. The different combinations of wet and dry etches lead to different yields and surface appearance of the absorber sidewalls. We present results on the achieved pixel yields and the energy resolution of pixels made with the various fabrication methods. We discuss the impact of absorber patterning method on performance, uniformity, and yield.

Edward J Wassell↗