Search NASASearch

Engineering topics

Vreeland, T., Jr.

Publications and source records attributed to Vreeland, T., Jr..

Orbiting dynamic compression laboratory

In order to examine the feasibility of carrying out dynamic compression experiments on a space station, the possibility of using explosive gun launchers is studied. The question of whether powders of a refractory metal (molybdenum) and a metallic glass could be well considered by dynamic compression is examined. In both cases extremely good bonds are obtained between grains of metal and metallic glass at 180 and 80 kb, respectively. When the oxide surface is reduced and the dynamic consolidation is carried out in vacuum, in the case of molybdenum, tensile tests of the recovered samples demonstrated beneficial ultimate tensile strengths.

Ahrens, T. J.

Shock compaction of molybdenum powder

Shock recovery experiments which were carried out in the 9 to 12 GPa range on 1.4 distension Mo and appear adequate to compact to full density ( 45 (SIGMA)m) powders were examined. The stress levels, however, are below those calculated to be from 100 to approx. 22 GPa which a frictional heating model predicts are required to consolidate approx. 10 to 50 (SIGMA)m particles. The model predicts that powders that have a distension of m=1.6 shock pressures of 14 to 72 GPa are required to consolidate Mo powders in the 50 to 10 (SIGMA)m range.

Ahrens, T. J.

Enhanced adhesion from high energy ion irradiation

It has been found that the adhesion of thin metal films on insulators, semiconductors, and metals could be improved by subjecting the material to a high-energy ion bombardment. Griffith et al. (1982) have first suggested a use of this technique with insulators. The present investigation has the objective to determine the mechanism for the adhesion enhancement. A description is presented of a preliminary transmission electron microscopy (TEM) study of thinned bonded samples of silver on silicon using electron diffraction. It is found that irradiation of a variety of thin film-substrate combinations by heavy ion beams will provide a remarkable improvement in the adherence of the film. The evidence for the mechanism involved in the enhancement of adhesion is discussed.

Werner, B. T.