Engineering topics

Waters, John F.

Publications and source records attributed to Waters, John F..

7 records

NASA NTRS1995

Composite Of Bisfuran/Bismaleimide With Graphite Fibers

Composite-material specimens made of graphite fibers and matrix composed of experimental copolymer of bismaleimide and bisfuran. Found to have mechanical and thermal properties comparable or superior to those of similar composite-material specimens. Candidates for use as lightweight structural components to replace metal components in high-temperature aircraft applications. Bismaleimides used widely for other purposes because of low cost and ease in fabrication. Mechanical properties equal or exceed those of composite made with commercial formulation.

Meador, Mary Ann B.↗

NASA NTRS1994

Easily Processable High-Temperature Polyimide

Polymerization without volatile gases leads to high-quality resins. N-CYCAP (amiNe substituted CYClophane Addition Polyimide) is thermoset polyimide developed containing 4-amino{2.2}paracyclophane as end cap. Current improvements in synthesis of end cap include increasing yield to 60 percent overall and decreasing manufacturing time by simplifying synthetic procedure. Enables large-scale production and increases viability of cyclophane end caps for polymers for high-temperature applications. In comparison with neat resin moldings and composite matrix resins made of PMR-II-50, those made of N-CYCAP polymers found to be processable with lower void content and higher thermo-oxidative stability.

Sutter, James K.↗

NASA NTRS1994

Improved PMR Polyimides For Heat-Stable Laminates

Second-generation PMR-type polyimides (PMR-II polyimides) of enhanced thermo-oxidative stability prepared by substitution of para-aminostyrene (PAS) end caps for nadic-ester (NE) end caps used in prior PMR-II polyimides. Laminates unidirectionally reinforced with graphite fibers and made with PAS-capped resins exhibited thermo-oxidative stabilities significantly greater than those of similar laminates made with NE-capped PMR-II resins. One new laminate exhibited high retention of weight and strength after 1,000 h of exposure to air at 371 degrees C.

Vannucci, R. D.↗

NASA NTRS1992

Benzonorbornadiene end caps for PMR resins

Several ortho-disubstituted benzonorbornadiene derivatives are described. These molecules contain acid, ester, or anhydride functionality permitting their use as end caps in PMR (polymerization of monomer reactants) polyimide systems. The replacement of the currently used norbornenyl end caps with benzonorbornadienyl end caps affords resins of increased aromatic content. It also allows evaluation of some mechanistic aspects of PMR cross-linking. Initial testing of N-phenylimide model compounds and of actual resin formulations using the benzonorbornadienyl end cap reveals that they undergo efficient thermal crosslinking to give oligomers with physical properties and thermal stability comparable to commercial norbornene-end-capped PMR systems.

Panigot, Michael J.↗

NASA NTRS1992

Lower temperature curing thermoset polyimides utilizing a substituted norbornene endcap

Methoxycarbonyl bridgehead substituted nadic diacid monomethyl ester, when used as an endcapping monomer, lowered the cure temperature of thermoset PMR polyimides without seriously affecting other desirable properties, such as glass transition temperature and thermal oxidative stability. The C-13 CP/MAS NMR of model compounds was used to follow the cure of resin systems using both the unmodified nadic endcap and the methoxycarbonyl-substituted endcap. Rheological analysis and differential scanning calorimetry DSC also provided evidence for the lower curing nature of the substituted endcap. Two regioisomers of the bridgehead-substituted endcap were isolated, and their chemical structures were elucidated by X-ray crystallography. The model compound and molecular modeling studies conducted ruled out the possibility of regioisomeric imide formation in the substituted endcaps.

Waters, John F.↗

NASA NTRS1991

Long term isothermal aging and thermal analysis of N-CYCAP polyimides

The N-CYCAP polyimides utilize a (2,2) paracyclophane endcap that polymerizes and does not generate volatile gases during the cure process. These polyimides have both high glass temperatures (390 C) and an onset of decomposition in air of 560 C. Thermal oxidative stability (TOS) weight loss studies show that replacing 25 percent by weight of the paraphenylene diamine in the polymer backbone with metaphenylene diamine improves the weight loss characteristics. N-CYCAP neat resin samples performed better than PMR-II-50 when exposed at 343 and 371 C in air for up to 1000 hours. Preliminary composite studies show that both PMR-II-50 and N-CYCAP have better thermal stability when fabricated on T-40R. Higher isothermal aging temperatures of longer aging times are needed to determine the differences in TOS between composite samples of PMR-II-50 and N-CYCAP polyimides.

Sutter, James K.↗

NASA NTRS1991

Addition Curing Thermosets Endcapped with 4-Amino (2.2) Paracyclophane

A new family of addition curing polyimides were prepared that contained 4-amino (2.2)-paracyclophane as the endcap. An improved synthesis of the endcap 4-amino-(2.2) cyclophane was accomplished increasing the yield to 60 percent and simplifying the procedure. DSC and rheological analysis of endcapped polyimide oligomers confirmed that the onset for polymerization of the ethylene bridge was 250 C. C-13 CP/MAS NMR was used to determine the structural changes of the oligomers after thermal treatment. The cyclophane capped polyimides were successfully compression molded to form void free neat resin specimens. Tg's as high as 353 C were obtained by thermomechanical analysis for postcured samples. Preliminary thermal stability studies suggest that these resins have a high onset of decomposition ranging from 549 to 567 C.

Waters, John F.↗