Engineering topics

Winslow, J. W.

Publications and source records attributed to Winslow, J. W..

8 records

NASA NTRS1993

Thermal Cycling Fatigue in DIPs Mounted with Eutectic Tin-Lead Solder Joints in Stub and Gullwing Geometries

It has long been known that solder joints under mechanical stress are subject to failure. In early electronic systems, such failures were avoided primarily by avoiding the use of solder as a mechanical structural component. The rule was first to make sound wire connections that did not depend mechanically on solder, and only then to solder them. Careful design and miniaturization in modern electronic systems limits the mechanical stresses exerted on solder joints to values less than their yield points, and these joints have become integral parts of the mechanical structures. Unfortunately, while these joints are strong enough when new, they have proven vulnerable to fatigue failures as they age. Details of the fatigue process are poorly understood, making predictions of expected lifetimes difficult.

fatigue failure solder joints failure mechanisms s↗

NASA NTRS1993

(abstract) A Brief, Selective Review of Thermal Cycling Fatigue in Eutectic Tin-Lead Solder

This paper reviews selected parts of the current literature relevant to thermo-mechanical fatigue mechanisms in eutectic tin-lead solder, and suggests a general outline to account for some observed failures. The field is found to be complex. One recent experimental study finds some failure modes to be sensitive to joint geometry. Attempts to extrapolate from test environments to service environments have had only limited success. Much work remains to be done before fatigue failures in this material can be considered as under practical control.

environments↗

NASA NTRS1993

Some Observations of Solder Joint Failure Under Tensile-Compressive Stress

It has long been known that solder joints under mechanical stress are subject to failure. In early electronic systems, such failures were avoided primarily by avoiding the use of solder as a mechanical structural component. The rule was to first make sound wire connections that did not depend mechanically on solder, and only then to solder them. Careful design and miniaturization in modern electronic systems limits the mechanical stresses exerted on solder joints to values less than their yield points, and these joints have become integral parts of the mechanical structures. Unfortunately, while these joints are strong enough when new, they have proven vulnerable to fatigue failures as they age.Details of the fatigue process are poorly understood, making predictions of expected lifetimes difficult.

solder joints fatigue failure thermal cycling test↗

NASA NTRS1987

Radiation Effects on Polymer Properties

Report compiles data on effects of radiation on physical properties of synthetic organic materials. Emphasis on materials of interest to nuclear-equipment and nuclear-reactor designers. Data covers five categories of polymeric materials: Insulators, elastomeric seals and gaskets, lubricants, adhesives, and coatings. More than 250 materials represented.

Bouquet, F. L.↗

NASA NTRS1986

Radiation data definitions and compilation for equipment qualification data bank

Dose definitions, physical properties, mechanical properties, electrical properties, and particle definitions are listed for insulators and dielectrics, elastomeric seals and gaskets, lubricants, adhesives, and coatings.

Bouquet, F. L.↗

NASA NTRS1985

Synthetic Organic Materials in Nuclear Powerplants

Report aids plant designers and qualification engineers in ensuring that organic materials in nuclear powerplants will perform satisfactorily in such safety-related equipment as insulation on motor windings, pump diaphragms, motor and pump lubricants, and pump seals and gaskets. Report provides information for service that may include both mild and harsh nuclear environments.

Bouquet, F. L.↗

NASA NTRS1984

Radiation effects response data for synthetic organic insulation and dielectrics

Existing radiation response data for 130 materials of the synthetic organic insulation and dielectric class are analyzed, and thresholds and 25-percent change dose levels for these materials are presented. Both the lowest reported threshold dose (LTD) and the 25-percent change dose level are found to vary widely among the different insulators (used as spacecraft components). The LTD is tabulated to indicate the levels where radiation effects become apparent. These level are of use in setting a lower limit where changes can be expected, and could be used to exempt synthetic insulation and dielectrics from radiation considerations when the environments are substantially below this limit. Cautions to be observed in applying the data to current problems are presented.

Bouquet, F. L.↗

NASA NTRS1981

Packaging techniques for low-altitude Venus balloons beacon

The results of a specific design project for the Venus balloon beacon, in which a microwave beacon is required to operate for a limited time at high temperature (350 C) and at high pressure, (10 bars). In a chemically hostile environment after surviving large mechanical shock forces (up to 280 gs) are discussed. It was found that many existing, commerically-available component can be used in such a design with only minor modifications. A further result is that a crude (and consequently low-cost) test program can be designed to identify and select promising commercial components.

Borden, T. J.↗