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Wojciechowski, Kenneth E.

Publications and source records attributed to Wojciechowski, Kenneth E..

6 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2021

Neural interface methods and apparatus to provide artificial sensory capabilities to a subject

Embodiments of neural interfaces according to the present invention comprise sensor modules for sensing environmental attributes beyond the natural sensory capability of a subject, and communicating the attributes wirelessly to an external (ex-vivo) portable module attached to the subject. The ex-vivo module encodes and communicates the attributes via a transcutaneous inductively coupled link to an internal (in-vivo) module implanted within the subject. The in-vivo module converts the attribute information into electrical neural stimuli that are delivered to a peripheral nerve bundle within the subject, via an implanted electrode. Methods and apparatus according to the invention incorporate implantable batteries to power the in-vivo module allowing for transcutaneous bidirectional communication of low voltage (e.g. on the order of 5 volts) encoded signals as stimuli commands and neural responses, in a robust, low-error rate, communication channel with minimal effects to the subjects' skin.

Buerger, Stephen P.↗
DOE OSTI2017

Neural interface methods and apparatus to provide artificial sensory capabilities to a subject

Embodiments of neural interfaces according to the present invention comprise sensor modules for sensing environmental attributes beyond the natural sensory capability of a subject, and communicating the attributes wirelessly to an external (ex-vivo) portable module attached to the subject. The ex-vivo module encodes and communicates the attributes via a transcutaneous inductively coupled link to an internal (in-vivo) module implanted within the subject. The in-vivo module converts the attribute information into electrical neural stimuli that are delivered to a peripheral nerve bundle within the subject, via an implanted electrode. Methods and apparatus according to the invention incorporate implantable batteries to power the in-vivo module allowing for transcutaneous bidirectional communication of low voltage (e.g. on the order of 5 volts) encoded signals as stimuli commands and neural responses, in a robust, low-error rate, communication channel with minimal effects to the subjects' skin.

47 OTHER INSTRUMENTATION↗
DOE OSTI2015

A fully integrated oven controlled microelectromechanical oscillator -- Part I. Design and fabrication

Our paper reports the design and fabrication of a fully integrated oven controlled microelectromechanical oscillator (OCMO). This paper begins by describing the limits on oscillator frequency stability imposed by the thermal drift and electronic properties (Q, resistance) of both the resonant tank circuit and feedback electronics required to form an electronic oscillator. An OCMO is presented that takes advantage of high thermal isolation and monolithic integration of both micromechanical resonators and electronic circuitry to thermally stabilize or ovenize all the components that comprise an oscillator. This was achieved by developing a processing technique where both silicon-on-insulator complementary metal-oxide-semiconductor (CMOS) circuitry and piezoelectric aluminum nitride, AlN, micromechanical resonators are placed on a suspended platform within a standard CMOS integrated circuit. Operation at microscale sizes achieves high thermal resistances (~10 °C/mW), and hence thermal stabilization of the oscillators at very low-power levels when compared with the state-of-the-art ovenized crystal oscillators, OCXO. This constant resistance feedback circuit is presented that incorporates on platform resistive heaters and temperature sensors to both measure and stabilize the platform temperature. Moreover, the limits on temperature stability of the OCMO platform and oscillator frequency imposed by the gain of the constant resistance feedback loop, placement of the heater and temperature sensing resistors, as well as platform radiative and convective heat losses are investigated.

42 ENGINEERING↗
DOE OSTI2015

A fully integrated oven controlled microelectromechanical oscillator – Part II. Characterization and measurement

Our paper reports the measurement and characterization of a fully integrated oven controlled microelectromechanical oscillator (OCMO). The OCMO takes advantage of high thermal isolation and monolithic integration of both aluminum nitride (AlN) micromechanical resonators and electronic circuitry to thermally stabilize or ovenize all the components that comprise an oscillator. Operation at microscale sizes allows implementation of high thermal resistance platform supports that enable thermal stabilization at very low-power levels when compared with the state-of-the-art oven controlled crystal oscillators. A prototype OCMO has been demonstrated with a measured temperature stability of -1.2 ppb/°C, over the commercial temperature range while using tens of milliwatts of supply power and with a volume of 2.3 mm 3 (not including the printed circuit board-based thermal control loop). Additionally, due to its small thermal time constant, the thermal compensation loop can maintain stability during fast thermal transients (>10 °C/min). This new technology has resulted in a new paradigm in terms of power, size, and warm up time for high thermal stability oscillators.

42 ENGINEERING↗
DOE OSTI2013

Ultra-Thin, Temperature Stable, Low Power Frequency References

We have developed a MEMS based thin (<100 μm), temperature stable (< 1 parts-per-billion per degree Celsius (ppb/°C)), low power (<10 mW), frequency reference. Traditional high stability oscillators are based on quartz crystals. While a mature technology, the large size of quartz crystals presents important mission barriers including reducing oscillator thickness below 400 μm, and low power temperature stabilization (ovenizing). The small volume microresonators are 2 μm thick compared to 100’s of microns for quartz, and provide acoustic/thermal isolation when suspended above the substrate by narrow beams. This isolation enables a new paradigm for ovenizing oscillators at revolutionary low power levels <10 mW as compared to >300 mW for oven controlled quartz oscillators (OCXO). The oven controlled MEMS oscillator (OCMO) takes advantage of high thermal isolation and CMOS integration to ovenize the entire oscillator (AlN resonator and CMOS) on a suspended platform. This enables orders of magnitude reductions in size and power as compared with today's OCXO technology.

36 MATERIALS SCIENCE↗