TY  - RPRT
TI  - Method and apparatus for sputtering utilizing an apertured electrode and a pulsed substrate bias
AU  - Przybyszewski, J. S.
AU  - Shaltens, R. K.
PY  - 1973
UR  - https://ntrs.nasa.gov/citations/19730015842
ID  - 19730015842
ER  -