TY  - RPRT
TI  - Stuffed MO layer as a diffusion barrier in metallizations for high temperature electronics
AU  - Boah, J. K.
AU  - Russell, V.
AU  - Smith, D. P.
PY  - 1981
UR  - https://ntrs.nasa.gov/citations/19820007462
ID  - 19820007462
ER  -