TY  - RPRT
TI  - Creep behavior of copper at intermediate temperatures. II - Surface microstructural observations. III - A comparison with theory
AU  - Raj, S. V.
AU  - Langdon, T. G.
PY  - 1991
UR  - https://ntrs.nasa.gov/citations/19910063308
ID  - 19910063308
ER  -