@misc{indiciae451bc0d1b29f,
  title = {Packaging Technology for SiC High Temperature Circuits Operable up to 500 Degrees Centigrade},
  author = {Chen, Lian-Yu},
  year = {2002},
  url = {https://ntrs.nasa.gov/citations/20040053446},
  note = {Source identifier: 20040053446}
}