@misc{indiciaec133c8dde382,
  title = {Packaging Technology Developed for High-Temperature SiC Sensors and Electronics},
  author = {Chen, Liang-Yu and Hunter, Gary W. and Neudeck, Philip G. and Lei, Jih-Fen},
  year = {2000},
  url = {https://ntrs.nasa.gov/citations/20050192410},
  note = {Source identifier: 20050192410}
}