TY  - RPRT
TI  - Packaging Technology Developed for High-Temperature SiC Sensors and Electronics
AU  - Chen, Liang-Yu
AU  - Hunter, Gary W.
AU  - Neudeck, Philip G.
AU  - Lei, Jih-Fen
PY  - 2000
UR  - https://ntrs.nasa.gov/citations/20050192410
ID  - 20050192410
ER  -