@misc{indiciae979b151d3bd4,
  title = {Deep Reactive Ion Etching (DRIE) of High Aspect Ratio SiC Microstructures using a Time-Multiplexed Etch-Passivate Process},
  author = {Evans, Laura J. and Beheim, Glenn M.},
  year = {2006},
  url = {https://ntrs.nasa.gov/citations/20060005134},
  note = {Source identifier: 20060005134}
}