TY  - RPRT
TI  - Deep Reactive Ion Etching (DRIE) of High Aspect Ratio SiC Microstructures using a Time-Multiplexed Etch-Passivate Process
AU  - Evans, Laura J.
AU  - Beheim, Glenn M.
PY  - 2006
UR  - https://ntrs.nasa.gov/citations/20060005134
ID  - 20060005134
ER  -