@misc{indiciae86b1bb9ecd2f,
  title = {Packaging Technologies for High Temperature Electronics and Sensors},
  author = {Chen, Liangyu and Hunter, Gary W. and Neudeck, Philip G. and Beheim, Glenn M. and Spry, David J. and Meredith, Roger D.},
  year = {2013},
  url = {https://ntrs.nasa.gov/citations/20140004927},
  note = {Source identifier: 20140004927}
}