@misc{indiciae1d7853ec9c6f,
  title = {Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology},
  author = {Chen, Liang-Yu and Neudeck, Philip G. and Behelm, Glenn M. and Spry, David J. and Meredith, Roger D. and Hunter, Gary W.},
  year = {2015},
  url = {https://ntrs.nasa.gov/citations/20150023099},
  note = {Source identifier: 20150023099}
}