TY  - RPRT
TI  - Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology
AU  - Chen, Liang-Yu
AU  - Neudeck, Philip G.
AU  - Behelm, Glenn M.
AU  - Spry, David J.
AU  - Meredith, Roger D.
AU  - Hunter, Gary W.
PY  - 2015
UR  - https://ntrs.nasa.gov/citations/20150023099
ID  - 20150023099
ER  -