@misc{indiciae447c4886cb9b,
  title = {Packaging Technology for SiC High Temperature Electronics},
  author = {Chen, Liang-Yu and Neudeck, Philip G. and Spry, David J. and Meredith, Roger D. and Nakley, Leah M. and Beheim, Glenn M. and Hunter, Gary W.},
  year = {2017},
  url = {https://ntrs.nasa.gov/citations/20170008826},
  note = {Source identifier: 20170008826}
}