TY  - RPRT
TI  - Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications
AU  - Liang-Yu Chen
AU  - Philip G. Neudeck
AU  - David J. Spry
AU  - Gary W. Hunter
UR  - https://ntrs.nasa.gov/citations/20220010638
ID  - 20220010638
ER  -