@misc{indiciae058b91d07bd9,
  title = {Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications},
  author = {Liangyu Chen and Philip G. Neudeck and David J. Spry and Gary W. Hunter},
  url = {https://ntrs.nasa.gov/citations/20220010639},
  note = {Source identifier: 20220010639}
}