@misc{indiciae131d3e265557,
  title = {Pt/HTCC Alumina Based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications},
  author = {Liangyu Chen and Philip G Neudeck and David J Spry and Gary W Hunter},
  year = {2023},
  url = {https://ntrs.nasa.gov/citations/20230013082},
  note = {Source identifier: 20230013082}
}