TY  - RPRT
TI  - Pt/HTCC Alumina Based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications
AU  - Liangyu Chen
AU  - Philip G Neudeck
AU  - David J Spry
AU  - Gary W Hunter
PY  - 2023
UR  - https://ntrs.nasa.gov/citations/20230013082
ID  - 20230013082
ER  -