TY  - RPRT
TI  - Separating semiconductor devices from substrate by etching graded composition release layer disposed between semiconductor devices and substrate including forming protuberances that reduce stiction
AU  - Tauke-Pedretti, Anna
AU  - Nielson, Gregory N
AU  - Cederberg, Jeffrey G
AU  - Cruz-Campa, Jose Luis
PY  - 2015
UR  - https://www.osti.gov/biblio/1179228
ID  - 1179228
ER  -