TY  - RPRT
TI  - A MEMS lamination technology based on sequential multilayer electrodeposition
AU  - Kim, M
AU  - Kim, J
AU  - Herrault, F
AU  - Schafer, R
AU  - Allen, MG
PY  - 2013
DO  - 10.1088/0960-1317/23/9/095011
UR  - https://www.osti.gov/biblio/1211378
ID  - 1211378
ER  -