TY  - RPRT
TI  - Electrical resistivity of solid and liquid Cu up to 5 GPa: Decrease along the melting boundary
AU  - Ezenwa, Innocent C.
AU  - Secco, Richard A.
AU  - Yong, Wenjun
AU  - Pozzo, Monica
AU  - Alfè, Dario
PY  - 2017
DO  - 10.1016/j.jpcs.2017.06.030
UR  - https://www.osti.gov/biblio/1367930
ID  - 1367930
ER  -