@misc{indiciaec5ba60b58599,
  title = {High Density Chip Interconnect Technology Using High Density Glass Interposers},
  author = {Collier, Terence Quintin},
  year = {2018},
  doi = {10.2172/1457572},
  url = {https://www.osti.gov/biblio/1457572},
  note = {Source identifier: 1457572}
}