@misc{indiciae67daea9b1903,
  title = {HPC4Mfg with Samsung: Making semiconductor devices cool through HPC ab initio simulations},
  author = {Wang, Lin-Wang},
  year = {2020},
  doi = {10.2172/1617376},
  url = {https://www.osti.gov/biblio/1617376},
  note = {Source identifier: 1617376}
}