@misc{indiciae610541744125,
  title = {200 mm sensor development using bonded wafers},
  author = {Alyari, M. and Bradford, R. and Campanella, M. and Camporeale, P. and Demina, R. and Everts, J. and Gecse, Z. and Halenza, R. and Heintz, U. and Holland, S. and Hong, S. and Korjenevski, S. and Lampis, A. and Lipton, R. and Patti, R. and Segal, J. and Shin, K. W.},
  year = {2021},
  doi = {10.1088/1748-0221/16/02/t02002},
  url = {https://www.osti.gov/biblio/1633092},
  note = {Source identifier: 1633092}
}