TY  - RPRT
TI  - Copper Electrodeposition from Deep Eutectic Solvents—Voltammetric Studies Providing Insights into the Role of Substrate: Platinum vs Glassy Carbon
AU  - Vukmirovic, Miomir B.
AU  - Adzic, Radoslav R.
AU  - Akolkar, Rohan
PY  - 2020
DO  - 10.1021/acs.jpcb.0c02735
UR  - https://www.osti.gov/biblio/1635369
ID  - 1635369
ER  -